Photonic Interconnects for High-Density IC Signal Transmission

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Solution Overview

Problem

The increasing density of transistors and memory cells in semiconductor chips leads to a higher need for interconnects, resulting in larger circuit board surface areas and longer bus wires, which increases data transmission time and is limited by interference and thermal effects, making it difficult to continue miniaturization with wire-based interconnects.

Innovation Solution

Photonic-based interconnects using photonic nodes and waveguides to transmit electromagnetic signals between electronic mosaics, offering higher speeds and bandwidth compared to traditional wire-based interconnects by utilizing photonic crystals and waveguides to propagate signals at nearly the speed of light and enabling multiple signals to be transmitted through a single fiber.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If wire-based interconnects are used to increase transistor density, then more transistors can be integrated, but data transmission time increases and interference/thermal effects worsen

Engineering Contradiction:
Improvetransistor densityVSAvoiddata transmission time
Core Design Contradiction:
Quantity of substanceVSLoss of time

Solution Approach 1:

The patent replaces electrical signal transmission through wire-based interconnects with optical signal transmission through photonic interconnects. This substitution enables faster data transmission speeds (near speed of light) compared to electrical signals, directly addressing the increasing data transmission time caused by higher transistor density and longer wire lengths.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the fundamental transmission medium parameter from electrical signals to optical signals. This parameter change enables transmission at significantly higher speeds and reduces the harmful effects of interference and thermal limitations that constrain wire-based electrical interconnects.

Inventive Principle:
Principle #35Parameter changes

2Quantity of substance

If wire-based interconnects are used to increase transistor density, then more transistors can be integrated, but interference and thermal effects increase

Engineering Contradiction:
Improvetransistor densityVSAvoidinterference and thermal effects
Core Design Contradiction:
Quantity of substanceVSObject-affected harmful factors

Solution Approach 1:

The patent substitutes electrical signal transmission with optical signal transmission, eliminating the harmful electrical interference and thermal effects that plague wire-based interconnects. Optical signals are immune to electromagnetic interference and generate minimal thermal effects, allowing higher transistor density without these limiting factors.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Speed

If photonic-based interconnects are used to transmit electromagnetic signals, then data transmission speed increases, but device complexity increases

Engineering Contradiction:
Improvedata transmission speedVSAvoidinterconnect structure complexity
Core Design Contradiction:
SpeedVSDevice complexity

Solution Approach 1:

The patent segments the photonic interconnect system into distinct functional components: photonic nodes for signal generation/detection, waveguides for signal transmission, and photonic crystals for signal modulation. This segmentation allows each component to be optimized independently while working together to achieve high-speed transmission.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces photonic crystals as intermediary structures that enable efficient coupling between optical and electrical domains. These photonic crystals act as mediators that modulate optical signals without requiring direct optical-electrical conversion at every interface, simplifying the overall system architecture.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Photonic-based interconnects significantly reduce data transmission time and increase bandwidth by transmitting electromagnetic signals at twice the speed of electrical signals, eliminating the need for multiplexing and demultiplexing at chip boundaries, thus overcoming the limitations of traditional wire-based interconnects.

Implementation Method 1

transmitting data encoded in electromagnetic signals using photonic-based interconnects has a number of advantages over transmitting data encoded in electrical signals over wire-based interconnects

Methodology Applied
Scientific EffectElectromagnetic signal propagation: Electromagnetic Induction

Implementation Method 2

utilizing photonic crystals and waveguides to propagate signals at nearly the speed of light

Methodology Applied
Scientific EffectPhotonic crystal effect: Photonic Crystal

Data Source

PatentUS7894699B2Photonic based interconnects for interconnecting multiple integrated circuits
Publication Date: 2011.02.22 HEWLETT PACKARD ENTERPRISE DEV LP
  • US7894699B2 patent drawing
  • US7894699B2 patent drawing
  • US7894699B2 patent drawing

AI summary

Various embodiments of the present invention are directed to photonic-based interconnects for transmitting data encoded in electromagnetic signals between electronic mosaics. In one embodiment of the present invention, a photonic-based interconnect comprises a first photonic node coupled to a second photonic node via a waveguide. The first photonic node is coupled to a first electronic mosaic and is configured to transmit electromagnetic signals encoding data generated by the first electronic mosaic to a second electronic mosaic and receive electromagnetic signals encoding data generated by the second electronic mosaic. The second photonic node is coupled to the second electronic mosaic and is configured to transmit electromagnetic signals encoding data generated by the second electronic mosaic to the first electronic mosaic and receive electromagnetic signals encoding data generated by the first electronic mosaic. The bus waveguide is configured to transmit electromagnetic signals between the first photonic node and the second photonic node.