Photonic Interposer Structure for High-Bandwidth Chiplet Data Transport
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Solution Overview
Problem
Semiconductor packages face challenges with limited data transport bandwidth and low energy efficiency due to conventional electrical signal transmission between components.
Innovation Solution
Incorporating optical waveguides and IC photonic dies within the interposer structure to facilitate photon-based data transport, enhancing data transport bandwidth and energy efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional electrical signal transmission is used between components, then the semiconductor package can be fabricated using standard processes, but the data transport bandwidth is limited and energy efficiency is low
Solution Approach 1:
The patent replaces electrical signal transmission with optical signal transmission through waveguides. This substitution enables photon-based data transport instead of electron-based transport, achieving high bandwidth density (>4 Tbps/mm) and low energy consumption (<1 pJ/bit) by eliminating resistive losses and enabling parallel optical channels
Solution Approach 2:
The patent changes the fundamental transmission parameter from electrical signals to optical signals. By integrating photonic components and using light instead of electricity for data transport, the system achieves superior bandwidth and energy efficiency characteristics that cannot be obtained through conventional electrical transmission
2Productivity
If optical waveguides and photonic components are integrated into the interposer, then data transport bandwidth and energy efficiency are enhanced, but the device complexity increases
Solution Approach 1:
The patent merges photonic components (waveguides, photonic dies) with the electronic interposer structure into a single integrated platform. This combination allows simultaneous electrical and optical interconnections within the same package, achieving high performance without requiring separate standalone photonic systems
Solution Approach 2:
The interposer is designed to serve multiple functions: it provides both electrical interconnection through conventional metal traces and optical interconnection through waveguides. This multi-functionality allows the same substrate to handle different types of signal transmission, reducing the need for additional dedicated photonic substrates
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high bandwidth density (>4 Tbps/mm) and low energy consumption (<1 pJ/bit) data transport by integrating photonic components within the interposer, improving semiconductor package performance.
Implementation Method 1
an optical waveguide including a core material surrounded by a cladding material, wherein the core material has an index of refraction that is greater than an index of refraction of the cladding material
Data Source
AI summary
Interposers for semiconductor packages including photonic components, such as an optical waveguide and/or an integrated circuit (IC) photonic die, integrated into the interposer. The interposer includes a substrate, a redistribution structure over the substrate, where the redistribution structure includes a plurality of conductive features in a dielectric material, and an optical waveguide located over and/or within the substrate. The optical waveguide includes a core material surrounded by a cladding material, where the core material has an index of refraction that is greater than an index of refraction of the cladding material, and the optical waveguide is configured to transmit optical signals through the interposer to and/or from an IC photonic die electrically coupled to an IC electronic die that provides an interface between electronic and photonic components of the semiconductor package. In various embodiments, improved data transport bandwidth and energy efficiency in the semiconductor package may be provided.