Photonic Interposer Waveguide Layout for Low-Loss Optical Packaging
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Solution Overview
Problem
Current semiconductor packages lack efficient integration of optical and electrical signaling, limiting their performance and flexibility in communication between devices, particularly in high-speed applications where electrical signal degradation occurs.
Innovation Solution
An interposer with embedded waveguides, such as nitride waveguides, is used to route both electrical and optical signals, enabling the integration of photonic and electronic devices within a semiconductor package, allowing for efficient edge-mount or vertically-mounted optical fibers and enhanced design flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If electrical signaling is used for signal transmission, then short-range signal transmission and processing are achieved, but signal degradation occurs in high-speed applications
Solution Approach 1:
The patent replaces electrical signaling with optical signaling for high-speed data transmission. Optical fibers and waveguides are used to transmit optical signals between photonic devices, eliminating the signal degradation issues inherent in electrical signaling at high speeds. The conversion between optical and electrical domains is achieved through photonic devices such as modulators, detectors, and amplifiers integrated into the package.
2Length of stationary object
If optical fibers are used for long-range signal transmission, then transmission distance is improved, but integration with electrical components becomes complex
Solution Approach 1:
The patent merges optical and electrical components into a single integrated photonic package. Multiple photonic devices including optical fibers, waveguides, modulators, detectors, and electrical components are co-integrated within the same package structure, allowing seamless interaction between optical signaling for long-range transmission and electrical signaling for processing and control.
Solution Approach 2:
The photonic package structure provides multi-functionality by supporting both long-range optical transmission and short-range electrical processing within the same system. The package can handle different signal types and transmission distances, making it universally applicable to various communication scenarios without requiring separate dedicated systems.
3Reliability
If heterogeneous integration of III-V devices is implemented, then device performance is improved, but manufacturing complexity increases
Solution Approach 1:
The patent segments the integration process into distinct stages: III-V photonic devices are first fabricated separately on their own substrates where optimal growth conditions can be maintained, then transferred and integrated into the final photonic package. This segmentation allows each component to be manufactured using specialized processes while simplifying the overall integration challenge.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances power and performance by enabling high-speed optical signaling with low coupling loss, supporting heterogeneous integration of III-V devices and reducing costs through the use of organic materials for interposers, which also facilitate high-density routing.
Implementation Method 1
An interposer with embedded waveguides, such as nitride waveguides, is used to route both electrical and optical signals
Data Source
AI summary
A semiconductor package includes a first interposer having a first substrate, a first redistribution structure over a first side of the first substrate, and a first waveguide over the first redistribution structure and proximate to a first side of the first interposer, where the first redistribution structure is between the first substrate and the first waveguide. The semiconductor package further includes a photonic package attached to the first side of the first interposer, where the photonic package includes: an electronic die, and a photonic die having a plurality of dielectric layers and a second waveguide in one of the plurality of dielectric layers, where a first side of the photonic die is attached to the electronic die, and an opposing second side of the photonic die is attached to the first side of the first interposer, where the second waveguide is proximate to the second side of the photonic die.