Photonic Interposer Waveguide Layout for Hybrid Optical Routing
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Solution Overview
Problem
Existing semiconductor packages face challenges in efficiently integrating both electrical and optical signal routing, particularly in providing efficient edge-mount and vertically-mounted optical fiber communication, while maintaining design flexibility and reducing signal loss.
Innovation Solution
An interposer with embedded waveguides is used to integrate both electrical and optical signals, allowing for efficient edge-mount and vertically-mounted optical fiber communication, and includes a silicon interposer with integrated photonic packages and electronic dies, utilizing dielectric materials for optimal optical coupling and reduced signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional electrical signaling is used for signal transmission, then short-range signal transmission and processing are achieved, but signal loss increases and performance is limited for long-range communication
Solution Approach 1:
The patent combines electrical signaling and optical signaling into a single hybrid package structure. Electrical dies are integrated with photonic dies that contain waveguides, allowing the system to use electrical signals for short-range processing and optical signals for long-range transmission through the waveguides, thereby reducing overall signal loss while maintaining versatility across different communication ranges.
Solution Approach 2:
The package structure is designed to perform multiple functions: electrical signal processing through electronic dies and optical signal transmission through photonic waveguides. This multi-functional integration allows the same package to handle both short-range electrical communication and long-range optical communication, providing adaptability across different transmission distances without requiring separate systems.
2Loss of energy
If optical fibers are mounted for long-range signal transmission, then signal loss is reduced, but design flexibility and integration with electrical components become more difficult
Solution Approach 1:
The patent merges optical waveguide functionality directly into the package substrate, eliminating the need for separate optical fiber mounting structures. The waveguides are fabricated as integrated structures within the package, allowing optical signals to be routed through the substrate itself, which simplifies the overall design and reduces integration complexity while maintaining low signal loss.
Solution Approach 2:
The package substrate acts as an intermediary that bridges electrical and optical domains. The substrate contains both electrical interconnects and optical waveguides, and includes conversion structures that enable interaction between electrical signals from the electronic dies and optical signals in the waveguides. This intermediary structure simplifies integration by providing a unified platform for both signal types.
3Adaptability or versatility
If both electrical and optical components are integrated in the same package, then full-fledged applications with conversion capabilities are achieved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges electrical dies and photonic dies into a single integrated package using wirebond or flip-chip interconnects. The electrical dies containing electronic circuits are directly connected to the photonic dies containing waveguides and optical components, creating a unified structure that enables seamless signal conversion between electrical and optical domains while managing complexity through systematic integration.
Solution Approach 2:
The package substrate serves as an intermediary platform that facilitates integration between electrical and optical components. It provides mechanical support, electrical interconnects, and optical routing pathways, and includes structures for converting between electrical and optical signals. This intermediary role of the substrate simplifies the overall integration process by providing a common platform for heterogeneous components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances power and performance by enabling efficient signal routing and communication with external devices, reducing signal loss, and providing design flexibility in semiconductor packages.
Implementation Method 1
an interposer with embedded waveguides is used to integrate both electrical and optical signals
Implementation Method 2
utilizing dielectric materials for optimal optical coupling and reduced signal loss
Data Source
AI summary
A semiconductor package includes a first interposer having a first substrate, a first redistribution structure over a first side of the first substrate, and a first waveguide over the first redistribution structure and proximate to a first side of the first interposer, where the first redistribution structure is between the first substrate and the first waveguide. The semiconductor package further includes a photonic package attached to the first side of the first interposer, where the photonic package includes: an electronic die, and a photonic die having a plurality of dielectric layers and a second waveguide in one of the plurality of dielectric layers, where a first side of the photonic die is attached to the electronic die, and an opposing second side of the photonic die is attached to the first side of the first interposer, where the second waveguide is proximate to the second side of the photonic die.