Photonic Laser Heat-Transfer Layer for Lower Thermal Resistance
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Solution Overview
Problem
Existing photonic devices with III-V semiconductor laser sources integrated into silicon substrates face inefficiencies in heat dissipation, which can affect the performance and stability of the laser sources due to the obstruction caused by dielectric layers.
Innovation Solution
The implementation of a photonic device with heat-dissipating means that include a heat-transferring layer made of electrically insulating materials with high thermal conductivity, such as polymeric materials, AlN, or silicon, which partially overlaps the contact pads and is in thermal contact with heat-transferring elements, along with additional vias and metal inserts to efficiently dissipate heat away from the laser source.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If dielectric layers are used to confine laser radiation in the waveguide, then optical losses are limited, but heat dissipation is obstructed and laser heating increases
Solution Approach 1:
The device structure is segmented into distinct functional layers: dielectric layers for optical confinement and metal heat-dissipating layers for thermal management. This segmentation allows each layer to perform its specialized function without interfering with the other, resolving the contradiction between optical confinement and heat dissipation.
Solution Approach 2:
Metal layers are introduced as intermediary elements between the laser source and the substrate. These metal layers serve dual purposes: they facilitate heat dissipation from the laser while being positioned within the photonic structure to maintain optical confinement, thus mediating between the conflicting requirements of low optical loss and effective heat dissipation.
2Temperature
If heat-dissipating means are added to improve heat dissipation, then temperature control improves, but device complexity increases
Solution Approach 1:
The metal layers are designed to perform multiple functions simultaneously: they serve as heat-dissipating structures and can also function as electrical interconnection elements or optical elements depending on their position and properties. This multi-functionality reduces the need for separate dedicated heat-dissipating components, thereby limiting the increase in device complexity.
Solution Approach 2:
The heat-dissipating function is merged with existing structural elements of the photonic device. Rather than adding completely separate heat dissipation mechanisms, the invention integrates heat-dissipating metal layers into the existing layer structure, combining thermal management with the device's structural framework.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the temperature difference between the laser source and the heat dissipation plate, improving the stability and performance of the laser source by limiting heating and enhancing heat dissipation efficiency.
Implementation Method 1
first heat-dissipating means configured to dissipate heat capable of being emitted by the laser source, the first means comprising a heat-transferring layer and a heat-transferring element in thermal contact with the heat-transferring layer
Data Source
AI summary
A photonic device comprises a heterogenous laser source and heat-dissipating means that are configured to dissipate the heat liable to be emitted by the laser source. The heat-dissipating means implements a heat-transferring layer and a heat-transferring element that are arranged to interact with contact pads accessible on the front side of the photonic device and, the heat-transferring layer is made of an electrically insulating material and makes contact with either or both of the contact pads. The heat-transferring element is located exclusively in contact with the heat-transferring layer.