Photonic Light Distribution Using Remote Lasers and SOA Splitting
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Solution Overview
Problem
Current approaches for distributing unmodulated light signals to multiple outputs in high-bandwidth applications face challenges such as high power consumption, device failure, eye safety issues, complex packaging, and increased cost due to multiple lasers and optical isolators, as well as limitations in bandwidth density and scalability.
Innovation Solution
A photonic integrated circuit (PIC) system that remotely locates a laser source from the PIC, using a semiconductor optical amplifier (SOA) to split and amplify low- to moderate-power light signals, allowing for multiple outputs with improved reliability, cost-effectiveness, and scalability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high-power lasers are used to distribute light signals to multiple outputs, then the optical power available for distribution is increased, but the lifetime of the lasers is reduced and catastrophic device failure occurs
Solution Approach 1:
The patent divides the high-power laser distribution function into multiple low-power laser sources, each serving a subset of outputs. This segmentation allows each laser to operate at safe power levels while collectively providing the required total optical power to all outputs, thereby maintaining reliability while achieving the necessary power distribution.
Solution Approach 2:
The patent introduces optical amplifiers as intermediary devices between the laser sources and the output ports. These amplifiers boost the optical power of lower-power laser signals to the required levels, enabling the system to achieve high optical power output without requiring individual high-power lasers, thus preserving laser lifetime and reliability.
2Power
If multiple lasers are used to generate lower-power light signals for different data modulators, then the optical power per laser is reduced, but the cost and device complexity increase due to multiple control electronics modules and optical isolators
Solution Approach 1:
The patent merges multiple laser sources and their associated control electronics into a single integrated photonic circuit platform. By co-integrating multiple laser diodes, waveguides, and control circuits on one chip, the system reduces the need for separate control electronics modules and optical isolators, thereby lowering overall device complexity and cost while maintaining multiple low-power laser outputs.
Solution Approach 2:
The patent designs a universal photonic integrated circuit platform that can simultaneously support multiple laser sources, optical amplifiers, and data modulators on a single chip. This multi-functional integration allows the system to perform multiple functions (laser generation, amplification, modulation) without requiring separate dedicated components for each function, reducing overall system complexity.
3Productivity
If high-power light signals are split multiple times to distribute to numerous outputs, then the bandwidth density per unit area is maintained, but fiber-optic systems and photonic-integrated circuit waveguides become susceptible to failure due to interface burns and nonlinearities
Solution Approach 1:
The patent applies optical amplification at intermediate stages within the distribution network, before signals are further split and distributed to final outputs. This preliminary amplification compensates for splitting losses and maintains signal power within safe operating ranges, preventing interface burns and nonlinear effects in waveguides and fibers while enabling multiple distribution stages for high bandwidth density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves lower power consumption, reduced device failure risk, improved eye safety, and enhanced bandwidth density by using remotely located lasers and SOAs, enabling scalable and efficient light distribution.
Implementation Method 1
semiconductor optical amplifier (SOA) to split and amplify low- to moderate-power light signals
Implementation Method 2
photonic integrated circuits comprising optical splitters and semiconductor optical amplifiers
Data Source
AI summary
The present disclosure is directed to light-distribution systems on photonic integrated circuits (PIC) that split and amplify a light signal received from at least one remotely located laser into a plurality of amplified light signals, where amplification is provided by an integrated semiconductor optical amplifier (SOA). By locating the laser remotely with respect to the SOA-based PIC, the laser and PIC can be subjected to different ambient environmental conditions. Additionally, a lower-power laser can be used since the optical loss associated with splitting is compensated for by the amplification. As a result, lower current densities and optical powers can be used in both the source laser and the SOA. In some embodiments, the sequence of power splitting and amplification is repeated multiple times, thereby enabling system to scale gracefully.