Photonic Memory Interconnect Architecture Beyond Parasitic Impedance

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Solution Overview

Problem

Conventional computing systems face limitations in scaling memory capacity and bandwidth, primarily due to parasitic impedance in electrical communication paths, which restricts the distance between memory chips and processors and limits the number of memory chips that can be accommodated.

Innovation Solution

The development of photonic communication platforms that utilize photonic modules with optical distribution networks and waveguides, allowing for optical communication between photonic modules and dies, thereby eliminating the limitations imposed by parasitic impedance and enabling flexible scaling of memory capacity and bandwidth.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If electrical communication paths are used to connect memory chips and processors, then data transmission can be achieved, but parasitic impedance limits the distance and number of memory chips that can be accommodated

Engineering Contradiction:

Improvenumber of memory chipsVSAvoidparasitic impedance

Core Design Contradiction:

Quantity of substanceVSObject-affected harmful factors

Solution Approach 1:

The patent replaces electrical communication paths with optical communication paths using photonic modules, waveguides, and optical interconnects. This substitution eliminates parasitic impedance inherent in electrical systems, enabling extended communication distances and support for larger numbers of memory chips without the limiting effects of electrical resistance and signal degradation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the fundamental transmission medium from electrical signals to optical signals, transitioning the communication parameter domain from electrical conductivity to optical properties. This parameter change allows memory chips to be positioned at greater distances from processors and enables higher bandwidth communication without being constrained by parasitic impedance effects.

Inventive Principle:

Principle #35Parameter changes

2Quantity of substance

If the distance between memory chips and processors is increased to accommodate more memory chips, then memory capacity can be scaled, but parasitic impedance increases and degrades signal quality

Engineering Contradiction:

Improvememory capacityVSAvoidparasitic impedance

Core Design Contradiction:

Quantity of substanceVSObject-affected harmful factors

Solution Approach 1:

The patent substitutes optical communication infrastructure (photonic modules, waveguides, optical interconnects) for electrical communication paths, enabling memory chips to be positioned at extended distances from processors. Optical signals do not suffer from parasitic impedance, allowing memory capacity scaling without signal degradation even over longer distances.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Productivity

If more memory chips are accommodated in the system, then memory bandwidth can be increased, but the complexity of electrical communication paths increases and becomes difficult to manage

Engineering Contradiction:

Improvememory bandwidthVSAvoidcomplexity of communication paths

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent replaces complex electrical communication paths with an optical communication network using photonic modules and waveguides. This substitution simplifies the management of high-bandwidth communication by eliminating parasitic impedance effects, reducing signal degradation, and enabling more straightforward scaling of memory bandwidth without proportionally increasing communication path complexity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for significant scaling of memory capacity and bandwidth beyond conventional limits, enhances data-intensive computing capabilities, and supports various computer architectures by enabling efficient optical communication without the constraints of parasitic impedance.

Implementation Method 1

a first optical waveguide optically coupling the optical distribution network to a first neighboring photonic module

Methodology Applied

Scientific EffectOptical waveguide: Waveguide (optics)

Data Source

PatentUS12332479B2Photonic communication platform

Publication Date: 2025.06.17 LIGHTMATTER INC

AI summary

Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.