Photonic Module Cavity Layout for Stress-Free Optical Routing
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Solution Overview
Problem
Photonic integrated circuits (PICs) face issues with reliability and size constraints due to the use of molding compounds, which can apply stress and complicate optical routing, and densely packed optical devices impact performance.
Innovation Solution
An optical module design featuring a carrier and lid with a first cavity, an interconnection structure with apertures for light transmission/reception, and electrical contacts, allowing for a photonic component to change light propagation direction and reduce size by exposing optical devices to air, eliminating stress and simplifying routing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a molding compound is used to encapsulate the photonic integrated circuit, then the optical devices are protected, but stress is applied to the optical devices which may ruin them
Solution Approach 1:
The patent removes the molding compound encapsulation from the photonic integrated circuit. The cavity is left open or filled with a stress-free material, extracting the harmful molding compound process while maintaining structural protection through the carrier and lid design.
2Reliability
If a molding compound is used to encapsulate the photonic integrated circuit, then the optical devices are protected, but the size of the PIC cannot be reduced
Solution Approach 1:
The molding compound is completely removed from the design. The photonic integrated circuit is mounted directly on the carrier within the cavity, eliminating the bulky encapsulation structure and enabling significant size reduction while maintaining device protection through the carrier substrate.
3Volume of moving object
If optical devices are densely packed to reduce size, then space utilization increases, but optical routing paths become complicated impacting performance
Solution Approach 1:
The patent utilizes the three-dimensional cavity space to route optical paths. By allowing optical routing in multiple dimensions within the open cavity rather than being constrained to a planar layout, complex optical paths can be implemented without compromising performance even when devices are densely packed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances reliability and reduces size, improves optical performance by avoiding stress on optical devices and optimizing routing paths, while maintaining structural stability and increasing space utilization.
Implementation Method 1
The photonic component is configured to change a first propagation direction of a first light to a second propagation direction toward the first aperture
Data Source
AI summary
An optical module is disclosed. The optical module includes a carrier and a lid disposed over the carrier. The carrier and the lid are collaboratively define a first cavity for accommodating a photonic component. The optical module also includes a first electrical contact disposed over a first side of the lid and configured to provide an electronic connection for the optical module. A first aperture penetrating the lid is formed at the first side of the lid and corresponds to a light transmission/reception area of the photonic component.