Photonic Assembly Optical Connector for Flexible Fiber Coupling
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Solution Overview
Problem
Existing photonic integrated circuits (PICs) and electronic integrated circuits (EICs) face challenges in efficient optical-electrical transmission and high manufacturing costs due to reliance on metal-to-metal bonding and complex alignment, limiting flexibility and scalability in advanced optical systems.
Innovation Solution
The use of microbump bonding and optical components for direct optical signal transmission between PICs and packaging substrates, eliminating the need for metal-to-metal bonding, and incorporating optical deflectors and connectors for flexible channeling of laser light between photonic integrated circuits and fibers, along with fiber array units and heat sinks for structural support and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal-to-metal bonding is used for connecting PICs and EICs, then electrical connection reliability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent introduces an interposer substrate as an intermediary component between the PIC die and EIC die. This interposer provides a standardized bonding interface with bump structures that simplify the connection process. The interposer substrate acts as a mediator that enables electrical connections without requiring direct complex metal-to-metal bonding between the photonic and electronic dies, thereby reducing manufacturing complexity while maintaining connection reliability.
Solution Approach 2:
The patent divides the packaging system into separate functional modules: a PIC die for photonic functions, an EIC die for electronic functions, and an interposer substrate for interconnection. This segmentation allows each component to be optimized and manufactured independently using standard processes, reducing overall manufacturing complexity while maintaining reliable electrical connections through the modular bump interface.
2Manufacturing precision
If complex alignment processes are used for bonding PICs and EICs, then connection precision is improved, but manufacturing time and cost increase
Solution Approach 1:
The patent implements preliminary alignment features during the die design and fabrication stage. The PIC die and EIC die are designed with predefined bonding pad patterns and alignment marks that enable automated alignment during assembly. This preliminary preparation eliminates the need for complex real-time alignment processes, allowing standard automated bonding equipment to achieve precise connections quickly, thereby improving manufacturing speed without sacrificing precision.
Solution Approach 2:
The interposer substrate provides self-aligning bump structures that automatically guide the positioning of the PIC and EIC dies during assembly. The bump patterns on the interposer create a self-correcting mechanism that ensures proper alignment without requiring complex external alignment equipment or processes, thus maintaining high connection precision while enabling faster automated assembly.
3Stability of the object's composition
If traditional packaging structures are used, then structural stability is improved, but heat dissipation capability worsens
Solution Approach 1:
The patent replaces traditional mechanical thermal management structures with a integrated heat sink system that is structurally integrated into the packaging substrate. The heat sink features are formed as part of the packaging structure itself, using the same substrate material, which maintains structural stability while providing efficient thermal conduction paths. This substitution of the thermal management approach allows heat to be conducted away from the PIC and EIC through the structurally sound packaging substrate, simultaneously achieving structural integrity and improved heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs and enhances flexibility in producing advanced optical systems by enabling efficient optical-electrical transmission and reducing heat generation, while allowing for diverse coupling modes between PICs and external fibers.
Implementation Method 1
an optical deflector configured to change a beam direction between a vertical beam path and a horizontal beam path
Implementation Method 2
an optical deflector configured to change a beam direction between a vertical beam path and a horizontal beam path
Implementation Method 3
an optical connector unit comprising a first connector-side mirror reflector and a first transition edge coupler
Implementation Method 4
fiber array units and heat sinks for structural support and heat dissipation
Data Source
AI summary
A photonic assembly includes: a composite die including a photonic integrated circuits (PIC) die and an electronic integrated circuits (EIC) die, the PIC die including waveguides and photonic devices therein, and the EIC die including semiconductor devices therein; an optical connector unit including a first connector-side mirror reflector and a first transition edge coupler and attached to a top surface of the composite die, wherein the first connector-side mirror reflector is configured to change a beam direction between a vertically-extending beam path through the composite die and a horizontally-extending beam path through the first transition edge coupler; and a fiber array units assembly attached to a sidewall of the optical connector unit.