Photonic Package Coupling With Recessed Optical Adhesive Gaps
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Solution Overview
Problem
Existing photonic systems face challenges in efficiently coupling optical signals between adjacent photonic packages due to gaps that are not optimally filled with optical glue, leading to suboptimal optical coupling and performance.
Innovation Solution
A method is developed to deposit optical glue into recesses formed in photonic packages, allowing it to flow into the gaps between adjacent packages, forming a stack that improves optical coupling by reducing these gaps and ensuring the glue does not adhere to undesired surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If gaps between adjacent photonic packages are filled with optical glue, then optical coupling is improved, but optical glue may adhere to undesired surfaces such as top surfaces and conductive connectors
Solution Approach 1:
A recess is formed in a support structure of the photonic package before assembly, creating a pre-prepared cavity that guides the optical glue flow. This preliminary structural modification ensures the glue is directed into the gap between packages rather than adhering to undesired surfaces, resolving the contradiction between achieving good optical coupling and preventing harmful adhesion.
2Reliability
If optical glue is deposited on top surfaces of photonic packages, then optical coupling may be improved, but subsequent processing becomes difficult and yield decreases
Solution Approach 1:
The recess is positioned specifically in the support structure away from the top surface, creating a localized cavity that receives optical glue. This local structural feature ensures glue is contained within the recess and does not contaminate the top surface, thereby maintaining ease of manufacture and subsequent processing while still achieving proper optical coupling.
3Loss of energy
If gaps between photonic packages are reduced to improve optical coupling, then signal loss decreases, but manufacturing precision requirements increase
Solution Approach 1:
The recess is formed in advance in the support structure at a controlled depth and position. This preliminary action creates a mechanical constraint that defines the exact gap width between adjacent packages, transforming the manufacturing challenge from requiring ultra-precise positioning to a more controllable recess formation process, thereby reducing signal loss while maintaining manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the optical coupling between photonic packages, improving the operation of the photonic system by reducing signal loss and enhancing efficiency.
Implementation Method 1
depositing the optical adhesive into the gap... allowing it to flow into the gaps between adjacent packages
Data Source
AI summary
A method includes connecting a first photonic package to a substrate, wherein the first photonic package includes a first waveguide and a first support over the first waveguide; connecting a second photonic package to the substrate adjacent the first photonic package, wherein the second photonic package includes a second waveguide, wherein the first photonic package and the second photonic package are laterally separated by a gap that has a width in the range of 15 μm to 190 μm; depositing a first quantity of an optical adhesive into the gap; and curing the first quantity of the optical adhesive, wherein after curing the first quantity of the optical adhesive, the first waveguide is optically coupled to the second waveguide through the first quantity of the optical adhesive.