Photonic-Electronic Package Assembly With Edge-Coupled Optical Port
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Solution Overview
Problem
Existing semiconductor package fabrication methods are inadequate for robust interconnection between photonic dies, electronic dies, and optical fibers, particularly in achieving efficient optical signal transmission and processing.
Innovation Solution
The development of a package assembly that includes a photonic die and an electronic die optically coupled with an optical signal port, utilizing an optical interface layer for bonding fibers to the package component, and a redistribution structure for electrical coupling, enabling efficient optical and electrical signal exchange.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If existing fabrication methods are used for semiconductor packages, then general-purpose functionality is achieved, but robust interconnection between photonic dies, electronic dies, and optical fibers cannot be established
Solution Approach 1:
The package assembly is divided into distinct functional modules: photonic dies for optical signal generation/detection, electronic dies for signal processing, and optical fibers for signal transmission. Each module is independently fabricated and then interconnected through specialized interfaces, allowing robust connections while maintaining manufacturing feasibility through modular assembly processes
Solution Approach 2:
Optical interface layers are introduced as intermediary structures between photonic dies and optical fibers. These interface layers include bonding layers and alignment features that facilitate reliable mechanical and optical coupling, solving the interconnection challenge without requiring direct bonding between dissimilar materials
2Volume of moving object
If photonic dies and electronic dies are integrated in a compact package, then compactness is achieved, but challenges arise in developing robust interconnection processes
Solution Approach 1:
The interconnection architecture utilizes three-dimensional stacking of photonic and electronic dies with vertical and lateral interconnect paths. Redistribution structures are formed in multiple layers to route signals between densely packed dies, achieving compact footprint while maintaining robust electrical and optical connections through multi-dimensional interconnect topology
Solution Approach 2:
Smaller functional units are nested within larger package structures. Photonic dies with integrated waveguides are embedded within electronic packaging substrates, and optical fibers are routed through dedicated channels within the package. This nested arrangement maximizes space utilization while preserving interconnection reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the integration of photonic and electronic components, achieving high-speed and low-power operation with improved optical signal transmission and processing capabilities.
Implementation Method 1
an optical interface layer for bonding fibers to the package component
Implementation Method 2
photonic dies (known as P-dies) and electronic dies (known as E-dies) are becoming increasingly popular for their compactness
Data Source
AI summary
A package assembly and a manufacturing method thereof are provided. The package assembly includes a first package component and an optical signal port disposed aside the first package component. The first package component includes a first die including an electronic integrated circuit, a first insulating encapsulation laterally covering the first die, a redistribution structure disposed on the first die and the first insulating encapsulation, and a second die including a photonic integrated circuit and electrically coupled to the first die through the redistribution structure. The optical signal port is optically coupled to an edge facet of the second die of the first package component.