Photonic Electronic Package Layout for Compact Low-Loss Fiber Coupling
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Solution Overview
Problem
Conventional semiconductor packages with photonic components face challenges such as large layout area occupation, difficulty in controlling warpage, and high insertion loss due to the proximity of switch dies and optical engine modules, as well as interference issues with the packaging substrate.
Innovation Solution
The electronic package design includes an electronic module with separated first and second connection areas, where the photonic component is connected to the second connection area, which protrudes from the carrying structure, creating a gap between the photonic component and the carrying structure. This configuration reduces the layout area and facilitates easy connection to an optical fiber without interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the switch die and optical engine module are arranged adjacent to each other on the packaging substrate, then the connection distance is reduced, but the layout area occupied is extremely large and warpage becomes difficult to control
Solution Approach 1:
The patent transitions from a planar arrangement to a three-dimensional stacked architecture. The optical engine module is positioned above the packaging substrate at a predetermined distance, utilizing the vertical dimension (Z-axis) rather than occupying lateral space on the substrate. This dimensional change reduces the layout area while maintaining short connection distances through vertical interconnects.
2Reliability
If the photonic IC is externally connected to the optical fiber, then optical signal transmission is achieved, but interference issues occur with the packaging substrate when the position is poorly designed
Solution Approach 1:
The photonic IC is extracted from the packaging substrate plane and positioned in a separate spatial location above the substrate. This separation removes the source of optical interference from the substrate environment, eliminating harmful interactions while preserving optical signal transmission functionality through proper spatial isolation.
3Device complexity
If the photonic IC is placed close to the optical fiber connection point, then connection complexity is reduced, but interference with the packaging substrate increases
Solution Approach 1:
The photonic IC is positioned in the vertical dimension above the packaging substrate rather than in the lateral plane. This spatial reconfiguration reduces connection complexity by aligning the photonic IC directly above the optical fiber connection point while simultaneously eliminating interference issues through vertical separation from the substrate.
Data Source
AI summary
An electronic package and a manufacturing method thereof are provided, in which an electronic module including a bridging component and an electronic component is partially arranged on a carrying structure and partially protrudes outside the carrying structure, and a photonic component is electrically connected to the protruding part of the electronic module. With this configuration, the layout area of the carrying structure can be reduced to meet the requirement of miniaturization.