Photonic Package Frame Structure for Resin Support During Mounting
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Solution Overview
Problem
Current package structures in headlights, encapsulated by white resin, suffer from insufficient structural strength and supportability during the mounting process, leading to potential damage and leakage of blue light due to inadequate resin thickness.
Innovation Solution
A package structure incorporating a carrier with first and second metal pads and a multi-layer metal frame that surrounds the photonic device, creating an accommodating space and enhancing the structural strength and supportability of the encapsulant.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the package structure is encapsulated by white resin only, then the manufacturing process is simple, but the structural strength and supportability are insufficient
Solution Approach 1:
The patent applies composite materials by combining white resin with a metal frame structure. The frame provides rigid structural support while the resin provides encapsulation and protection, creating a composite structure that achieves both manufacturing simplicity and enhanced structural strength.
Solution Approach 2:
The package structure is segmented into distinct functional components: the metal frame provides structural support and the white resin provides encapsulation. This segmentation allows each material to perform its optimal function while maintaining overall structural integrity.
2Volume of moving object
If the white resin thickness is reduced to accommodate smaller package size, then the package size is reduced, but the supportability becomes insufficient
Solution Approach 1:
By introducing a metal frame, the patent creates a composite structure where the frame bears the mechanical loads, allowing the resin thickness to be reduced without compromising supportability. The frame acts as a structural skeleton that maintains strength despite reduced resin volume.
Solution Approach 2:
The patent transitions from relying solely on resin thickness (one-dimensional support) to a multi-dimensional support system where the metal frame provides structural integrity in multiple dimensions, enabling reduced resin thickness while maintaining overall supportability.
3Device complexity
If the package structure uses only white resin encapsulation, then the device complexity is low, but the reliability during mounting process deteriorates
Solution Approach 1:
The metal frame-resin composite structure provides enhanced reliability during mounting by distributing mechanical stresses. The frame's rigidity protects against deformation from suction nozzle pressure, while the resin maintains its encapsulation function, achieving high reliability with moderate complexity increase.
Data Source
AI summary
A package structure includes a carrier, a frame, and at least one photonic device. The carrier includes a substrate and a plurality of first metal pads and second metal pads. The substrate includes a first surface and a second surface that are opposite to each other. The first metal pads are disposed on the first surface. The second metal pads are disposed on the second surface. A thickness of each of the second metal pads is greater than that of each of the first metal pads. The frame is disposed on the carrier, and an accommodating space is formed between the frame and the carrier. The at least one photonic device is disposed in the accommodating space.