3D Photonic Package Interposer for High-Speed Optical-Electrical Routing
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Solution Overview
Problem
Current technologies face challenges in integrating optical and electrical components effectively for high-speed signal transmission and processing, particularly in forming efficient photonic packages that combine optical and electrical signals, leading to limitations in performance and design flexibility.
Innovation Solution
The development of three-dimensional (3D) photonic packages that include both optical and electrical devices, with an interposer structure facilitating high-speed electrical signal transmission and optical signal processing, using techniques such as damascene processes for fine-pitch routing and dielectric-to-dielectric bonding to enhance optical coupling and reduce signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical and electrical components are integrated in traditional packaging approaches, then signal transmission capability is improved, but device complexity and manufacturing difficulty increase significantly
Solution Approach 1:
The patent divides the photonic package into separate functional modules: an optical device layer containing waveguides and photonic components, and an electrical device layer containing electronic components, with an interposer structure facilitating their interaction. This segmentation allows independent optimization and manufacturing of each layer while maintaining integration benefits.
Solution Approach 2:
The patent transitions from planar integration to three-dimensional stacking, where optical and electrical devices are positioned in different vertical layers. The interposer structure enables vertical interconnections, allowing high-density integration without increasing lateral footprint, thus reducing manufacturing complexity while maintaining signal transmission capability.
2Speed
If fine-pitch routing is implemented for high-speed signal transmission, then signal speed is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent introduces an interposer structure as an intermediary layer between optical and electrical devices. This interposer contains the fine-pitch routing structures, isolating the high-precision manufacturing requirements from the final package assembly. The interposer can be manufactured separately with controlled precision, then bonded to the optical and electrical devices, reducing overall manufacturing difficulty.
3Loss of energy
If dielectric-to-dielectric bonding is used for optical coupling, then optical signal loss is reduced, but process complexity increases
Solution Approach 1:
The patent merges the optical waveguide layer and electrical device layer through dielectric-to-dielectric bonding of the interposer structure. This direct bonding approach eliminates the need for separate optical coupling components or complex alignment mechanisms, reducing optical signal loss while consolidating the bonding process into a single manufacturable step.
4Adaptability or versatility
If traditional packaging methods are used, then design simplicity is maintained, but design flexibility and performance are limited
Solution Approach 1:
The interposer structure serves multiple functions simultaneously: it provides mechanical support, enables electrical interconnections, facilitates optical coupling, and allows for thermal management. This multi-functional design enables greater adaptability and versatility in photonic package configurations without requiring separate specialized components for each function.
Data Source
AI summary
A package includes an interposer structure including a first via; a first interconnect device including conductive routing and which is free of active devices; an encapsulant surrounding the first via and the first interconnect device; and a first interconnect structure over the encapsulant and connected to the first via and the first interconnect device; a first semiconductor die bonded to the first interconnect structure and electrically connected to the first interconnect device; and a first photonic package bonded to the first interconnect structure and electrically connected to the first semiconductor die through the first interconnect device, wherein the first photonic package includes a photonic routing structure including a waveguide on a substrate; a second interconnect structure over the photonic routing structure, the second interconnect structure including conductive features and dielectric layers; and an electronic die bonded to and electrically connected to the second interconnect structure.