Photonic Package With Si/SiN Waveguides for Laser Coupling
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Solution Overview
Problem
Existing photonic packages face challenges in achieving efficient optical coupling and heterogeneous integration of laser diodes, leading to increased manufacturing costs and reduced performance.
Innovation Solution
The integration of silicon and silicon nitride waveguides with a laser diode in a photonic package, utilizing dielectric-to-dielectric bonding and heterogeneous integration techniques, allows for improved optical coupling and reduced manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If traditional electrical signaling and processing are used for signal transmission, then short-range signal transmission and processing can be achieved, but long-range signal transmission efficiency deteriorates
Solution Approach 1:
The system segments signal transmission into two distinct modes: optical signaling for long-range transmission and electrical signaling for short-range transmission and processing. This segmentation allows each signaling type to operate in its optimal performance range, with optical fibers handling long-distance communication and electrical components handling local processing and short-range communication.
Solution Approach 2:
Optical-to-electrical and electrical-to-optical conversion components serve as intermediaries between the optical and electrical signaling domains. These conversion devices enable seamless transition between optical long-range transmission and electrical short-range processing, allowing the system to leverage the strengths of both signaling types.
2Length of moving object
If optical fibers are used for long-range signal transmission, then transmission distance is improved, but integration with electrical processing components becomes more complex
Solution Approach 1:
The patent merges optical components (optical fibers, optical-to-electrical converters) and electrical components (electrical-to-optical converters, processing circuits) into a single integrated package. This consolidation reduces the overall system complexity by providing a pre-integrated module that handles both optical transmission and electrical processing without requiring complex external integration.
Solution Approach 2:
The integrated package serves multiple functions simultaneously: long-range optical signal transmission, optical-to-electrical conversion, electrical signal processing, and electrical-to-optical conversion. This multi-functionality reduces the need for separate dedicated components and simplifies the overall system architecture.
3Adaptability or versatility
If laser diodes are integrated into photonic packages, then optical signal generation capability is improved, but manufacturing cost increases
Solution Approach 1:
Laser diodes are pre-integrated into the photonic package during the manufacturing process rather than being added separately later. This preliminary integration allows for optimized positioning and connection of the laser diodes to the waveguides, reducing assembly complexity and overall manufacturing cost while maintaining full optical signal generation capability.
Solution Approach 2:
The laser diodes are merged with the photonic package components (waveguides, couplers, and other optical elements) into a single integrated structure. This merging eliminates the need for separate laser diode mounting and alignment procedures, thereby reducing manufacturing steps and costs while providing complete optical signal generation functionality.
4Reliability
If heterogeneous integration techniques are used, then device performance is improved, but manufacturing process complexity increases
Solution Approach 1:
The patent employs parameter changes in the bonding process, specifically using dielectric-to-dielectric bonding with controlled temperature and pressure parameters. By optimizing these process parameters, the heterogeneous integration of different materials (such as silicon nitride waveguides and other photonic components) achieves high performance while managing manufacturing complexity through well-defined process conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances optical coupling efficiency, reduces manufacturing costs, and improves device performance by allowing for the heterogeneous integration of laser diodes within the photonic package.
Implementation Method 1
bonding a laser substrate die to the structure and then processing the laser substrate die to form the laser diode
Implementation Method 2
silicon and silicon nitride waveguides with an integrated laser diode
Data Source
AI summary
A package includes a laser diode includes a bonding layer; a first dielectric layer over the laser diode, wherein the first dielectric layer is directly bonded to the bonding layer of the laser diode; a first silicon nitride waveguide in the first dielectric layer, wherein the first silicon nitride waveguide extends over the laser diode; a second dielectric layer over the first silicon nitride waveguide; a silicon waveguide in the second dielectric layer; an interconnect structure over the silicon waveguide; and conductive features extending through the first dielectric layer and the second dielectric layer to electrically contact the interconnect structure.