Photonic Package Lens Array Layout for Higher Optical I/O Density
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Solution Overview
Problem
Existing optical and electrical signaling and processing technologies face challenges in integrating and optimizing the signal and processing technologies for efficient bandwidth and increasing the data transmission capabilities of the optical engine, particularly in achieving effective compatibility with existing manufacturing processes and reducing manufacturing costs.
Innovation Solution
The embodiments provide methods for forming an optical package that includes an array of silicon (Si) lenses arranged in multiple rows, with corresponding rows of couplers positioned beneath these lenses, allowing for an increase in optical input/output (I/O) capacity and expanding optical communication bandwidth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If optical and electrical signaling technologies are integrated to provide full-fledged applications, then the data transmission capabilities and bandwidth are improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges optical and electrical signaling technologies into a single integrated device structure. The optical engine is directly integrated with the electrical circuit board, eliminating the need for separate optical modules and complex interconnection structures. This combining approach maintains high data transmission capabilities while reducing overall device complexity.
Solution Approach 2:
The integrated device serves multiple functions simultaneously - it performs both optical signal transmission and electrical signal processing within a single structure. The optical engine handles long-range optical communication while the electrical components manage short-range signaling and data processing, creating a universal platform that eliminates the need for separate dedicated devices.
2Productivity
If new optical integration methods are developed to increase optical I/O density, then the bandwidth and data transmission capabilities are improved, but the manufacturing cost and process compatibility deteriorate
Solution Approach 1:
The patent achieves high optical I/O density by optimizing geometric parameters of the optical engine structure. The lens array configuration, spacing between optical components, and focal length parameters are carefully adjusted to maximize the number of optical I/O channels within a compact footprint, thereby increasing optical I/O density without requiring fundamentally new manufacturing processes.
Solution Approach 2:
The optical engine uses a uniform array of identical lenses and optical components arranged in a regular pattern. This homogeneity allows for simplified manufacturing processes where the same fabrication techniques can be applied repeatedly across the entire array, reducing manufacturing complexity and cost while achieving high optical I/O density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The methods increase the optical I/O density, enabling efficient data transmission capabilities, and compatibility with existing manufacturing processes and reducing manufacturing costs.
Implementation Method 1
an array of coupling lenses on a top surface of the support substrate
Data Source
AI summary
A semiconductor package including a photonic package coupled to a first side of a package substrate, the photonic package including a semiconductor substrate, an array including multiple rows of coupling lenses on a top surface of the semiconductor substrate, and multiple rows of couplers disposed below the multiple rows of coupling lenses, where each coupler of the multiple rows of couplers is disposed below a corresponding coupling lens of the multiple rows of coupling lenses, first conductive connectors disposed between the photonic package and the first side of the package substrate, where the first conductive connectors are attached to first bond pads on the first side of the package substrate, and where at least one of the first conductive connectors includes a first intermetallic region, and second conductive connectors disposed on a second side of the package substrate that is opposite the first side.