Photonic Semiconductor Package for High-Speed Memory Data Links
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Solution Overview
Problem
Electrical connection wires in semiconductor packages restrict high-speed data transmission and lead to increased power consumption, especially in memory chips, due to low data transmission rates and the need for multiple connections.
Innovation Solution
Implementing a semiconductor package with a photonic integrated circuit chip and a first chip that converts electrical signals into optical signals, using parallel-to-serial and serial-to-parallel conversion units to enhance data transmission rates, and optimizing the layout with conductive wiring structures for reduced resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If electrical connection wires are used for data transmission in memory chips, then electrical signals can be transmitted between components, but data transmission rate is restricted and power consumption increases
Solution Approach 1:
The patent replaces electrical signal transmission through electrical connection wires with optical signal transmission through optical fibers. The photonic integrated circuit chip converts electrical signals to optical signals, which are then transmitted through optical fibers to achieve higher data transmission rates and lower power consumption compared to traditional electrical wiring
Solution Approach 2:
The patent changes the fundamental transmission medium parameter from electrical conductors to optical fibers, enabling signal transmission through light instead of electricity. This parameter change allows for significantly higher bandwidth and lower energy loss, directly addressing the contradiction between transmission speed and power consumption
2Productivity
If multiple electrical connection wires are used to connect memory chips, then data can be transmitted between chips, but device complexity and package size increase
Solution Approach 1:
The patent merges multiple electrical signal channels into a single optical transmission channel. The photonic integrated circuit chip aggregates data from multiple memory chips and converts it to optical signals for transmission through optical fibers, reducing the number of physical connections required while maintaining or enhancing data transmission capability
Solution Approach 2:
The photonic integrated circuit chip serves as an intermediary device between multiple memory chips and the external system. It receives electrical signals from multiple memory chips, converts them to optical signals, and transmits them through optical fibers, thereby simplifying the connection architecture and reducing overall system complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances data transmission rates and reduces power consumption by processing electrical signals with optical signals, optimizing electrical connections, and minimizing package size.
Implementation Method 1
a photonic integrated circuit chip... the first chip is electrically connected to the photonic integrated circuit chip, so that data is transmitted between the first chip and the photonic integrated circuit through an electrical signal
Implementation Method 2
the photonic integrated circuit chip is configured to output the second optical signal
Data Source
AI summary
A semiconductor package (100) and a data transmission method for the semiconductor package (100) are disclosed. The semiconductor package (100) includes a photonic integrated circuit chip (110), a plurality of memory chips (120), and a first chip (130). The first chip (130) is electrically connected to the photonic integrated circuit chip (110), so that data is transmitted between the first chip (130) and the photonic integrated circuit (110) through an electrical signal. The first chip (130) is further electrically connected to each memory chip (120), so that data is transmitted between the first chip (130) and each of the plurality of memory chips (120) via electrical signals.