Heterogeneous Photonic Package Structure with Optical Bus Integration
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Solution Overview
Problem
Achieving dense integration of optical components and electronic components in the same chip is challenging due to fabrication limits in conventional techniques.
Innovation Solution
The development of heterogeneous package structures that include electronic devices, photonic devices, bridge interconnect devices, and optical waveguide devices, which enable electrical and optical connections between electronic and photonic components, forming an integrated optical bus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If co-fabricating optoelectronic devices with CMOS integrated circuitry is used, then integration of optical and electronic components is achieved, but fabrication limits prevent dense integration
Solution Approach 1:
The patent divides the integrated system into separate photonic devices and electronic devices that are fabricated independently and then heterogeneous integrated into a single package. This segmentation allows each component to be optimized for its specific fabrication requirements while achieving high integration density in the final package, resolving the contradiction between integration density and fabrication precision limits.
Solution Approach 2:
The patent introduces bridge interconnect devices as intermediary components that facilitate electrical connections between photonic devices and electronic devices. These bridge interconnects serve as mediators that enable dense integration by providing standardized electrical interfaces between differently-fabricated components, overcoming the fabrication precision limitations of direct co-fabrication.
2Adaptability or versatility
If chip-scale integration with die partitioning is used, then photonic applications are enabled, but device complexity increases
Solution Approach 1:
The patent implements a heterogeneous package structure that serves multiple functions: photonic devices for optical signal generation and detection, electronic devices for signal processing, bridge interconnects for electrical connections, and optical waveguides for optical signal routing. This multi-functional integration enables diverse photonic applications while managing complexity through standardized interfaces and modular architecture.
Solution Approach 2:
The patent transitions from two-dimensional planar integration to three-dimensional vertical stacking, with package levels arranged in a vertically stacked configuration. This dimensional change allows photonic devices, electronic devices, and interconnect structures to be integrated in multiple layers, increasing functionality while reducing the footprint and managing structural complexity through vertical organization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for high-bandwidth optical communication systems with efficient electro-optical interfaces, enabling dense integration and improved performance in photonic applications.
Implementation Method 1
The at least one optical waveguide device is optically coupled to the at least one photonic device to implement an optical bus for routing optical signals in the package structure
Implementation Method 2
The at least one photonic device is configured to implement an electro-optical interface between the at least one electronic device and the optical bus
Data Source
AI summary
Heterogeneous package structures comprising photonic components are provided. For example, an exemplary package structure comprises at least one electronic device, at least one photonic device, at least one bridge interconnect device, and at least one optical waveguide device. The at least one bridge interconnect device is configured to electrically connect the at least one electronic device to the at least one photonic device. The at least one optical waveguide device is optically coupled to the at least one photonic device to implement an optical bus for routing optical signals in the package structure. The at least one photonic device is configured to implement an electro-optical interface between the at least one electronic device and the optical bus.