Photonic Package Structure With Embedded Optical Glue Coupling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing photonic and electronic package integration technologies face challenges in achieving high bandwidth and low power consumption due to inefficient optical coupling and interference from dielectric layers.
Innovation Solution
A photonic package is formed by bonding a photonic die to an electronic die, replacing dielectric layers with optical glue, and exposing the exterior sidewall of the optical glue for easy optical coupling, integrated with a redistribution structure and underfill material to ensure clear optical pathways.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dielectric layers are used in photonic package integration, then structural support and electrical insulation are provided, but optical coupling efficiency is reduced due to interference
Solution Approach 1:
The patent removes dielectric layers from the optical coupling path between the photonic die and optical component. By extracting these interfering layers, the optical coupling efficiency is improved while maintaining structural support through alternative means such as direct bonding interfaces and optimized packaging structures.
2Productivity
If optical fibers are coupled to edge couplers through dielectric layers, then package integration is achieved, but bandwidth is limited due to inefficient optical coupling
Solution Approach 1:
The patent optimizes critical parameters including the refractive index matching between materials, the gap distance between optical components, and the alignment precision of optical fibers to edge couplers. These parameter changes enable efficient optical coupling without dielectric layers, achieving high bandwidth performance.
3Reliability
If conventional bonding methods are used for photonic and electronic dies, then package assembly is simplified, but optical pathways are blocked by dielectric materials
Solution Approach 1:
The patent introduces specialized bonding interfaces and potentially intermediate materials with optimized optical properties that facilitate direct bonding between photonic and electronic dies without requiring traditional dielectric layers. This mediator approach maintains ease of manufacture while ensuring clear optical pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high bandwidth and ultra-low power consumption by facilitating efficient optical coupling between optical fibers and edge couplers, enhancing co-package optics integration.
Implementation Method 1
facilitating efficient optical coupling between optical fibers and edge couplers
Data Source
AI summary
A method of forming a semiconductor package includes: bonding a first wafer to a second wafer, where the first wafer includes a plurality of electronic dies, and the second wafer includes a plurality of photonic dies; after bonding the first wafer, forming trenches in the second wafer between adjacent ones of the plurality of photonic dies; filling the trenches with an optical glue; and dicing the first wafer and the second wafer to form a plurality of photonic packages, where a photonic package of the plurality of photonic packages includes an electronic die, a photonic die bonded to the electronic die, and the optical glue, where the optical glue extends along a sidewall of the photonic package.