Photonic Semiconductor Package With Lens-Coupled Optical I/O
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Solution Overview
Problem
Current copper data channels face limitations due to signal attenuation and crosstalk from radiated electromagnetic energy, which existing techniques like equalization, coding, and shielding can only partially address, and optical communication systems are costly and complex to manufacture.
Innovation Solution
A semiconductor package design incorporating a photonic die with an optical coupler and lens structure, where the photonic die is bonded with an electronic die and encapsulated, and a substrate with a lens structure is used to focus light beams, enabling efficient optical signal transmission while reducing signal degradation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If copper data channels are used to meet bandwidth requirements, then signal transmission is achieved, but signal attenuation and crosstalk from radiated electromagnetic energy occur
Solution Approach 1:
The patent substitutes electrical signal transmission through copper channels with optical signal transmission through photonic components. The copper data channel is replaced by a photonic die containing waveguides that transmit optical signals, eliminating electromagnetic radiation and associated signal attenuation and crosstalk issues.
2Reliability
If equalization, coding, and shielding techniques are applied to copper channels, then signal quality is improved, but power consumption, complexity, and cable bulk increase
Solution Approach 1:
The patent eliminates the need for complex equalization, coding, and shielding techniques by replacing the copper electrical transmission system with an optical transmission system. The photonic die with integrated waveguides provides inherent immunity to electromagnetic interference, simplifying the overall system architecture.
3Reliability
If contemporary optical communication systems are implemented, then signal transmission without electromagnetic limitations is achieved, but manufacturing cost and process complexity increase
Solution Approach 1:
The patent merges the photonic components (waveguides, optical couplers) and electronic components (lasers, detectors) into a single integrated photonic die. This integration consolidates multiple discrete optical components into one manufacturable unit, reducing assembly complexity and manufacturing costs while maintaining high signal transmission performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances signal transmission by reducing signal attenuation and crosstalk, offering improved scalability and performance without the complexity and cost of traditional optical communication systems.
Implementation Method 1
a lens structure, where the first lens structure is overlapped with the optical coupler from a top view, and the optical coupler is configured to be optically coupled to an optical signal source through the first lens structure
Data Source
AI summary
A semiconductor package includes a photonic die, an encapsulated electronic die, a substrate, and a lens structure. The photonic die includes an optical coupler. The encapsulated electronic die is disposed over and bonded to the photonic die. The encapsulated electronic die includes an electronic die and an encapsulating material at least laterally encapsulating the electronic die. The substrate is disposed over and bonded to the encapsulated electronic die. The lens structure is disposed over the photonic die and is overlapped with the optical coupler from a top view. The optical coupler is configured to be optically coupled to an optical signal source through the lens structure.