Photonic Package Raising Module for Fiber Alignment and Die Support

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Solution Overview

Problem

Existing photonic packages face challenges in aligning optical fibers with photonic dies due to the proximity of thin electronic dies, which are prone to breakage and require larger sizes to maintain mechanical integrity, complicating manufacturing processes.

Innovation Solution

The introduction of a raising module with through-vias that elevates the electronic die, providing mechanical support and allowing for easier alignment with optical fibers, while maintaining the electronic die's thinness and reducing the risk of breakage through a layered encapsulation process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the electronic die is made thinner to reduce size, then the device compactness is improved, but the mechanical strength decreases making the die prone to breakage

Engineering Contradiction:

Improvedevice sizeVSAvoidmechanical strength of electronic die

Core Design Contradiction:

Volume of moving objectVSStrength

Solution Approach 1:

A raising module is introduced as an intermediary component between the package substrate and the electronic die. This raising module provides mechanical support to the thin electronic die, preventing breakage while allowing the die to remain thin for compact device design. The raising module acts as a mediator that resolves the contradiction between thinness and mechanical strength.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Strength

If the electronic die is made thicker to improve mechanical strength, then the risk of breakage is reduced, but the device size increases and alignment with optical fibers becomes more difficult

Engineering Contradiction:

Improvemechanical strength of electronic dieVSAvoidoptical fiber alignment

Core Design Contradiction:

StrengthVSEase of operation

Solution Approach 1:

The raising module serves as a mediator that provides mechanical support to the electronic die without requiring the die itself to be thick. This allows the thin electronic die to be easily aligned with optical fibers while the raising module bears the mechanical load, preventing breakage during handling and operation.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Strength

If a raising module is introduced to support the electronic die, then the mechanical strength is improved, but the device complexity increases

Engineering Contradiction:

Improvemechanical strength of electronic dieVSAvoidpackage structure complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The raising module is designed to perform multiple functions: it provides mechanical support to the electronic die, elevates the die to an optimal height for optical fiber alignment, and serves as a mounting platform for the electronic die. By consolidating these functions into a single component, the overall device complexity is minimized while achieving the desired mechanical strength.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS20250343216A1Photonic packages with modules and formation method thereof

Publication Date: 2025.11.06 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A method includes bonding a module over a package component. The module includes a substrate and through-vias penetrating through the substrate. The method further includes molding the module in a molding compound, bonding an electronic die on the module, and bonding a photonic die over the electronic die.