Photonic Electronic Package Layout for Shorter Optical Signal Paths
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Solution Overview
Problem
Conventional semiconductor packages lack integration of silicon photonic elements, leading to lengthy signal transmission paths between communication chips and optical fibers, limiting the transmission speed of optical fiber communication equipment.
Innovation Solution
An electronic package is designed with a photonic element embedded in an encapsulation layer, where the photonic element protrudes as an external contact area with an electrical port, allowing direct signal transmission to an optical fiber, reducing the signal transmission path and enhancing speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If a silicon photonic chip is arranged on a circuit board to connect with an external optical fiber, then the connection with optical fiber is achieved, but the signal transmission path becomes lengthy and transmission speed cannot be increased
Solution Approach 1:
The patent merges the photonic element and electronic element into a single integrated package structure. The photonic element is embedded in the encapsulation layer and directly connected to the electronic element, eliminating the need for separate circuit board mounting and optical fiber connection. This integration directly reduces the signal transmission path length and increases transmission speed.
Solution Approach 2:
The photonic element is nested within the encapsulation layer of the electronic package. The encapsulation layer contains both the electronic element and the photonic element, with the photonic element's light-receiving surface facing the electronic element's light-emitting surface. This nested arrangement minimizes the distance between components and reduces the overall transmission path.
2Speed
If photonic elements are integrated into the packaging process, then transmission speed is increased, but the manufacturing complexity increases
Solution Approach 1:
The photonic element and electronic element are disposed on the carrier in advance before the encapsulation layer is formed. This preliminary arrangement allows for precise positioning and alignment of the components, simplifying the subsequent encapsulation process and reducing overall manufacturing complexity despite the integration benefits.
Data Source
AI summary
An electronic package and the manufacturing method thereof are provided, in which a photonic element and an electronic element are embedded in an encapsulation layer, and the photonic element has an external contact area exposed from the encapsulation layer, such that signals of the electronic element can be directly transmitted to an optical fiber via the external contact area of the photonic element to achieve the purpose of photoelectric integration.