Photonic Package Hot Spot Cooling With Embedded TEC
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Solution Overview
Problem
The thermal energy generated by a heater element in a photonic package creates a localized hot spot in the dielectric layers, posing thermal risks and reducing the reliability of the package.
Innovation Solution
Incorporating a thermoelectric cooling (TEC) device in the dielectric layers to dissipate heat from the localized hot spot region using the Peltier effect.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heater element is used to provide thermal energy to the photonic component, then the photonic component can be maintained at the desired operating temperature, but a localized hot spot is created in the dielectric layers causing thermal risks
Solution Approach 1:
A thermoelectric cooling (TEC) device is introduced as an intermediary element embedded in the dielectric layers directly beneath the photonic component. This TEC device acts as a mediator that actively removes excess heat from the localized hot spot region, allowing the heater element to maintain the photonic component at its desired operating temperature without creating harmful thermal conditions in the surrounding dielectric structure.
Solution Approach 2:
The solution applies local quality by embedding the TEC device specifically in the dielectric layers at the location where heat removal is most needed - directly beneath the photonic component and heater element. This localized cooling approach targets only the problematic hot spot region rather than cooling the entire package, thereby resolving the thermal contradiction in the specific area where it occurs while maintaining overall system temperature requirements.
2Stability of the object's composition
If thermal energy is provided to maintain photonic component temperature, then stable operation is achieved, but reliability is reduced due to thermal risks in dielectric layers
Solution Approach 1:
The TEC device serves as a protective intermediary that decouples the heater element's thermal output from the dielectric layers. By actively pumping heat away from the localized region, the TEC device allows the photonic component to receive necessary thermal energy for stable operation while protecting the dielectric structure from thermal degradation, thereby maintaining both stability and reliability.
Solution Approach 2:
The TEC device provides beforehand cushioning by proactively removing excess heat before it can accumulate to dangerous levels in the dielectric layers. This preventive cooling mechanism ensures that even though the heater element is actively providing thermal energy, the dielectric structure is protected from thermal runaway or degradation, thus maintaining package reliability while enabling stable photonic component operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The TEC device effectively cools the dielectric layers, reducing thermal risks and improving the reliability of the photonic package by maintaining the modulator at a stable operating temperature.
Implementation Method 1
Incorporating a thermoelectric cooling (TEC) device in the dielectric layers to dissipate heat from the localized hot spot region using the Peltier effect
Data Source
AI summary
A semiconductor package and the method for forming the same are provided. The semiconductor package includes an oxide layer, and a waveguide and a photonic component located on a first side of the oxide layer. The semiconductor package also includes a heater element adjacent to the photonic component and configured to provide thermal energy to the photonic component. The semiconductor package also includes a redistribution structure located on a second side of the oxide layer opposite the first side. The redistribution structure includes a plurality of dielectric layers and conductive features in the dielectric layers. In addition, the semiconductor package includes a thermoelectric cooling device embedded in the dielectric layers of the redistribution structure and located directly below the photonic component.