Photonic Semiconductor Package With Vertical Optical Coupling
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Solution Overview
Problem
Existing technologies face challenges in efficiently integrating optical and electrical components for signal conversion and processing, particularly in devices requiring both long-range optical and short-range electrical communication, leading to inefficiencies in signal transmission and processing.
Innovation Solution
The development of an optical package that includes an optical interposer with photonic components and an electronic die, featuring reflectors and lenses for vertical signal transmission, along with an interconnect structure for electrical connectivity, enabling efficient integration and communication between optical and electrical signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If optical and electrical components are integrated in the same package, then signal transmission efficiency is improved, but device complexity increases
Solution Approach 1:
The package is divided into distinct functional modules: an optical component (such as a laser diode or photodetector) and an electrical component (such as a CMOS circuit or memory device), each optimized for its specific function while being integrated within the same package structure. This segmentation allows independent optimization of optical and electrical pathways while maintaining overall system efficiency
Solution Approach 2:
An optical waveguide or optical interconnect structure serves as an intermediary element that couples the optical component and electrical component together, enabling efficient optical signal transmission between them while isolating their respective electrical and optical domains. This intermediary structure resolves the complexity by providing a dedicated optical pathway that avoids interference between electrical and optical signals
2Speed
If vertical optical signal transmission is implemented, then signal transmission speed is improved, but manufacturing precision requirements increase
Solution Approach 1:
Optical alignment features such as alignment marks, alignment grooves, or pre-positioned optical elements are incorporated into the package structure during manufacturing, enabling precise vertical alignment between optical components and waveguides before final assembly. This preliminary alignment action reduces the precision requirements during subsequent assembly steps and ensures accurate optical coupling
Solution Approach 2:
The optical coupling is designed to occur primarily in the vertical dimension through the package thickness, utilizing the third dimension (Z-axis) for optical signal transmission. This vertical dimension approach allows for more tolerant lateral alignment while achieving fast optical coupling, as the optical path is established through controlled vertical interfaces rather than requiring precise lateral positioning
3Adaptability or versatility
If both optical and electrical components are integrated, then functionality is improved, but ease of manufacture decreases
Solution Approach 1:
The manufacturing process is segmented into separate stages: optical component fabrication and electrical component fabrication are performed independently using their respective optimized processes, followed by a final integration stage where the two modules are assembled together. This segmentation allows each component type to be manufactured using standard, well-established processes while achieving integrated functionality in the final package
Solution Approach 2:
The package structure incorporates universal interfaces and standardized mounting configurations that can accommodate different types of optical and electrical components. This multi-functionality allows the same package design to be used for various applications (such as optical communication, sensing, or signal processing) by simply changing the specific optical or electrical components while maintaining the same integration architecture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution facilitates improved signal transmission and processing by allowing for efficient vertical optical signal transmission and electrical connectivity, enhancing the performance of photonic systems in devices that require both optical and electrical communication.
Implementation Method 1
A reflector may be configured to receive light from a photonic component of the structure and redirect the received light vertically
Implementation Method 2
A lens may be received from the reflector and configured to receive the vertically transmitted light and redirect the light into a waveguide of the structure
Data Source
AI summary
A package includes an interposer, wherein the interposer includes a first waveguide and a first reflector that is optically coupled to the first waveguide; and an optical package attached to the interposer, wherein the optical package includes a second waveguide; and a second reflector that is optically coupled to the second waveguide, wherein the second reflector is vertically aligned with the first reflector.