Photonic Package Layout for Laser-to-Waveguide Coupling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing photonic packages face challenges in achieving efficient optical coupling and reduced manufacturing costs while integrating optical and electrical components, particularly in heterogeneous integration of laser diodes.
Innovation Solution
The integration of silicon and silicon nitride waveguides with a laser diode in a photonic package, utilizing a buried oxide substrate and interposer for efficient edge-mount and vertically-mounted optical fibers, along with a redistribution structure for electrical connections, allows for improved optical coupling and reduced manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heterogeneous integration of laser diodes is implemented, then optical coupling efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The photonic package is divided into separate functional modules: a photonic die containing waveguides and grating couplers, an electronic die for electrical processing, and a substrate providing mechanical support and electrical connections. This segmentation allows each module to be optimized and manufactured independently, then integrated through standardized interfaces, thereby maintaining high optical coupling efficiency while reducing overall manufacturing complexity.
Solution Approach 2:
A substrate acts as an intermediary component between the photonic die and external systems. The substrate provides mechanical support, electrical connections via conductive traces, and mounting surfaces for optical fibers. This intermediary structure simplifies the integration process by providing standardized interfaces and reducing the complexity of directly assembling multiple precision components.
2Reliability
If optical and electrical components are integrated in a single package, then device performance is improved, but manufacturing cost increases
Solution Approach 1:
The package integrates optical and electrical components in separate functional areas on different dies, allowing each to be manufactured using optimized processes for its specific requirements. The photonic die is fabricated using photonic processes while the electronic die uses standard electronic manufacturing, then both are mounted on a common substrate. This segmentation enables cost-effective manufacturing while achieving high device performance through functional integration.
Solution Approach 2:
The substrate serves multiple functions simultaneously: providing mechanical support for both photonic and electronic components, establishing electrical connections through conductive traces, providing thermal management pathways, and serving as a mounting platform for optical fibers. This multi-functionality reduces the need for additional specialized components, thereby lowering manufacturing costs while maintaining integrated performance.
3Adaptability or versatility
If edge-mount and vertically-mounted optical fibers are used, then design flexibility is improved, but structural complexity increases
Solution Approach 1:
The substrate provides different local structures optimized for different fiber mounting requirements. Specific regions of the substrate are designed with edge-mount features including precision-machined V-grooves and alignment marks for lateral fiber positioning. Other regions provide vertically-mounted features with through-holes and adhesive pads for vertical fiber attachment. This local differentiation enables design flexibility for various optical coupling configurations while maintaining a relatively simple overall substrate structure.
Data Source
AI summary
A package includes a laser diode includes a bonding layer; a first dielectric layer over the laser diode, wherein the first dielectric layer is directly bonded to the bonding layer of the laser diode; a first silicon nitride waveguide in the first dielectric layer, wherein the first silicon nitride waveguide extends over the laser diode; a second dielectric layer over the first silicon nitride waveguide; a silicon waveguide in the second dielectric layer; an interconnect structure over the silicon waveguide; and conductive features extending through the first dielectric layer and the second dielectric layer to electrically contact the interconnect structure.