Photonic Packaging Thermal Insulation via PCB Segmentation
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Solution Overview
Problem
Current photonic integrated circuit (PIC) packaging faces challenges such as temperature management, heat dissipation, hermetic protection, and suboptimal optical coupling due to the use of standard PCB materials, which can lead to inefficient cooling, interference with optical interfaces, and increased manufacturing complexity.
Innovation Solution
The proposed solution involves a printed circuit board (PCB) with a planar surface, where the PIC is mounted either directly or via a submount, incorporating thermal vias and a dam to prevent adhesive flow, and using a glass block for reinforcing the fiber attach adhesive connection, allowing for thermal insulation and improved structural integrity, while maintaining a hermetic interface and optimizing optical coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If standard PCB material is used for mounting PIC, then manufacturing cost is reduced and ease of manufacture is improved, but temperature control efficiency deteriorates and heat dissipation becomes insufficient
Solution Approach 1:
The PCB is divided into multiple regions with different thermal properties. A first region containing the PIC has different thermal characteristics compared to a second region, allowing independent temperature control and heat dissipation optimization for each region while maintaining overall manufacturing simplicity.
Solution Approach 2:
Different regions of the PCB are assigned different thermal properties to meet local requirements. The first region is optimized for heat dissipation from the PIC, while the second region serves other functions, achieving localized temperature management without compromising overall ease of manufacture.
2Reliability
If hermetic protection is implemented for electrical interface, then reliability is improved, but optical interface functionality deteriorates due to interference
Solution Approach 1:
The packaging structure is segmented into distinct hermetic and non-hermetic zones. The hermetic protection is applied selectively to the electrical interface area, while the optical interface area remains accessible and free from hermetic sealing that would interfere with fiber coupling and optical functionality.
Solution Approach 2:
Hermetic protection is applied locally only where needed (electrical interface) rather than universally. This localized approach ensures reliability improvement at the electrical interface while preserving optical interface functionality and accessibility in other regions.
3Productivity
If edge coupling geometry is optimized for optical coupling, then optical coupling efficiency is improved, but device complexity increases
Solution Approach 1:
The invention implements sufficient edge coupling geometry optimization to achieve acceptable optical coupling efficiency without over-engineering the structure. The geometry is optimized to a practical degree that balances coupling performance with manufacturing simplicity and device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances temperature control, reduces stray light, and simplifies manufacturing by providing a robust and efficient packaging solution that addresses the challenges of temperature management and optical coupling, leading to improved performance and reliability of optoelectronic devices.
Implementation Method 1
thermal vias extending from said PIC through said PCB
Implementation Method 2
said opening... for thermally insulating said first region and said second region from one another
Implementation Method 3
providing, between said FA and said dam, a reinforcing member, preferably a glass block, for reinforcing said fiber attach adhesive connection
Data Source
AI summary
Provided herein is an optoelectronic device having a printed circuit board (PCB) with a planar PCB surface; a photonic integrated circuit (PIC) with a fiber attach region for attachment to a fiber array (FA) and an electronic interface for connecting to the PCB. The PIC is mounted on a portion of the PCB surface being an integral part of the PCB surface. The PCB has an opening preferably circumferentially surrounded by portions of the PCB and dividing the PCB surface in a first and second region for thermally insulating the first region and the second region from one another. The portion of the PCB surface on which the PIC is mounted belongs to the first region, and the connecting of the electronic interface to the PCB relates to at least one wire bond extending to the second region, preferably in the optoelectronic device.