Photonic Integrated Circuit Packaging With Side-Lens Optical Coupling
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Solution Overview
Problem
Packaging photonic integrated circuits (PICs) poses challenges in achieving high density, high bandwidth electrical communication and optical access, with existing architectures consuming substantial PIC area for fiber coupling and limiting electrical interconnect density.
Innovation Solution
A photonic packaging architecture that includes a PIC with a substantial active side covered by an insulating material, optical structures on the active side, and optical lens coupled to the lateral side, enabling high-density interconnects and optical coupling through a 3D stacked configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional fiber coupling architectures are used, then optical access is achieved, but substantial PIC area is consumed and electrical interconnect density is limited
Solution Approach 1:
The patent transitions from planar 2D fiber coupling architectures to a 3D stacked configuration where optical lenses are positioned vertically above the PIC. This dimensional change allows optical access without consuming lateral PIC area, thereby increasing electrical interconnect density on the chip surface.
Solution Approach 2:
Optical lenses are introduced as intermediary components that couple light to the PIC from a vertical direction. These lenses act as mediators between the optical fiber and the PIC, enabling optical access while freeing up PIC area for higher-density electrical interconnects.
2Productivity
If high-density electrical interconnects are implemented, then communication bandwidth increases, but manufacturing complexity increases
Solution Approach 1:
The system is segmented into separate functional modules: the PIC with electrical interconnects, the optical lenses, and the packaging structure. This segmentation allows each component to be optimized and manufactured independently using standard processes, reducing overall manufacturing complexity while enabling high-density interconnects on the PIC.
Solution Approach 2:
The packaging architecture provides multi-functionality by simultaneously supporting high-density electrical interconnects, optical coupling, and mechanical protection. This universal design approach consolidates multiple functions into a single integrated package, reducing manufacturing steps and complexity.
3Area of stationary object
If smaller PIC footprints are achieved, then integration density increases, but optical coupling becomes more difficult
Solution Approach 1:
Optical coupling is moved from the lateral dimension to the vertical dimension. Optical lenses are positioned above the PIC in the z-direction, allowing optical coupling without requiring lateral space on the PIC. This enables smaller PIC footprints while maintaining ease of optical coupling through vertical alignment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates high-density electrical and optical connections, reducing manufacturing complexity and cost while allowing smaller footprints and lower power consumption.
Implementation Method 1
an optical lens coupled to the PIC on the lateral side... enabling high-density interconnects and optical coupling
Data Source
AI summary
Photonic packages and device assemblies that include photonic integrated circuits (PICs) coupled to optical lenses on lateral sides of the PICs. An example photonic package comprises a package support, an integrated circuit (IC), an insulating material, a PIC having an active side and a lateral side substantially perpendicular to the active side. At least one optical structure is on the active side. A substantial portion of the active side is in contact with the insulating material, and the PIC is electrically coupled to the package support and to the IC. The photonic package further includes an optical lens coupled to the PIC on the lateral side. In some embodiments, the photonic package further includes an interposer between the PIC or the IC and the package support.