Photonic Integrated Circuit Packaging via Substrate Segmentation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
There are challenges in forming vias in the growth substrate of photonic integrated circuits, including immature processes and potential effects on devices within the circuit.
Innovation Solution
A packaging structure and manufacturing method that involve forming conductive openings in both the photonic integrated structure and the first substrate, allowing for electrical connection by aligning and bonding these openings, thereby facilitating conductive material connection without affecting the photonic integrated circuit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vias are formed in the growth substrate of photonic integrated circuit, then electrical connection is achieved, but the process may be immature or affect devices in the photonic circuit
Solution Approach 1:
The patent divides the electrical connection structure into two separate substrates: the photonic integrated circuit substrate and the electrical connection substrate. Each substrate is manufactured independently with its own conductive structures, avoiding the need to form vias through the photonic substrate which would risk affecting photonic devices. The two substrates are then bonded together to achieve the electrical connection.
2Ease of manufacture
If vias are formed in the growth substrate, then conductive structure passing through substrate is achieved, but process maturity and device safety are compromised
Solution Approach 1:
The patent segments the manufacturing process into two independent parts: forming conductive structures on the photonic substrate and forming conductive structures on the electrical substrate separately. This avoids the complex and risky via formation process in the photonic substrate while maintaining ease of manufacture through standard fabrication techniques on each substrate independently.
Solution Approach 2:
The electrical connection substrate acts as an intermediary that provides the conductive connection without requiring direct via formation through the photonic substrate. The bonding interface between the two substrates serves as the mediator that achieves electrical connectivity while protecting the photonic devices from the manufacturing process.
3Productivity
If photonic integrated structure and first substrate are manufactured independently and then bonded, then production cycle is shortened and processing flexibility is improved, but alignment precision of conductive openings must be maintained
Solution Approach 1:
The patent incorporates alignment marks on both substrates before the bonding process. These pre-formed alignment features enable precise registration of the conductive openings during bonding, ensuring that the independent manufacturing of the two substrates does not compromise the alignment precision required for electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for independent manufacturing of the photonic integrated structure and the first substrate, shortening the production cycle and enabling different processing methods for the openings, which reduces the risk of affecting the photonic integrated circuit during the formation of openings in the substrate.
Implementation Method 1
the conductive material in the first opening is electrically connected with the conductive material in the corresponding second opening
Data Source
AI summary
Disclosed are a packaging structure and a manufacturing method thereof, and a photonic integrated circuit chip (800). The manufacturing method of the packaging structure includes: providing a photonic integrated structure (100) including first openings (111) and a conductive material disposed in each first opening (111); providing a first substrate (201) including second openings (202) and a conductive material (204a) disposed in each second opening (202); and bonding the photonic integrated structure (100) and the first substrate (201) such that each first opening (111) is aligned with a corresponding second opening (202) and the conductive material in the first opening (111) is electrically connected with the conductive material (204a) in the corresponding second opening (202).