Photonic Ring Gyroscope Integration for Stable Alignment and Low Noise
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Solution Overview
Problem
Existing optical gyroscopes are bulky and require complex alignment and electrical connections, limiting their miniaturization and increasing fabrication costs and sensitivity to environmental perturbations.
Innovation Solution
An integrated optical chip (PIC) with resonant ring elements and waveguides on a substrate, combined with a printed circuit board, where all components are immovably attached and aligned, reducing noise and environmental sensitivity, and using flip-chip bonding for electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If separate optical elements are used in conventional optical gyroscopes, then alignment flexibility is maintained, but the device becomes bulky and sensitive to environmental perturbations
Solution Approach 1:
The patent integrates multiple separate optical elements (laser, beam splitters, polarizers, phase modulators, circulators, resonators, and photodetectors) into a single photonic integrated circuit chip. This merging of components eliminates the need for bulky mechanical supports and reduces sensitivity to environmental perturbations while maintaining precise alignment through the integrated fabrication process.
2Ease of manufacture
If multiple separate optical and electrical components are used, then functional flexibility is maintained, but fabrication complexity and cost increase
Solution Approach 1:
The patent combines optical components into a photonic integrated circuit and electronic components onto a printed circuit board, then integrates these two substrates. This approach simplifies fabrication by using standard photolithography and semiconductor manufacturing processes rather than complex mechanical assembly of separate components.
Solution Approach 2:
The photonic integrated circuit chip serves multiple functions simultaneously - it contains the laser source, optical modulators, resonators, beam splitters, and photodetectors. This multi-functionality in a single component reduces the overall system complexity and fabrication steps compared to assembling separate dedicated components.
3Stability of the object's composition
If bulky mechanical supports are used for alignment, then alignment stability is improved, but device miniaturization is limited
Solution Approach 1:
The patent eliminates bulky mechanical supports by integrating all optical elements directly onto a photonic integrated circuit chip. The alignment is achieved through precise photolithography patterns and semiconductor fabrication processes, providing stable alignment without requiring external mechanical support structures.
Solution Approach 2:
The patent replaces mechanical alignment systems with optical and electronic alignment methods. The photonic integrated circuit uses waveguide-based optical coupling and electronic feedback mechanisms to maintain precise alignment, substituting mechanical adjustments with integrated optical-electronic control.
4Reliability
If separate optical elements are used, then alignment adjustment flexibility is maintained, but noise and environmental sensitivity increase
Solution Approach 1:
The patent reduces noise and environmental sensitivity by merging all optical elements into a single photonic integrated circuit chip. The integrated structure eliminates interfaces and connections between separate components, reducing scattering losses and sensitivity to vibrations, temperature changes, and other environmental perturbations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated design results in a compact, reliable gyroscope with reduced noise and improved precision, enabling higher Q-factor and signal-to-noise ratio, and lower production costs.
Implementation Method 1
In such devices, a light phase shift due to Sagnac effect is used to measure angular velocity.
Implementation Method 2
a waveguide on a chip. The resonant ring and the waveguide are immovably attached to a substrate.
Data Source
AI summary
An optical ring resonator-based gyroscope includes a photonic integrated circuit (PIC) chip including a plurality of optical elements, the plurality of optical elements including a resonator ring; and a printed circuit board including a plurality of electrical components, the photonic integrated circuit being mounted on a surface of the printed circuit board, the photonic integrated circuit and the printed circuit board being electrically connected. A photonic integrated circuit (PIC) chip including a substrate; a dielectric layer; a first waveguide layer forming at least: a ring resonator and reflector portions; a second waveguide layer forming at least: vertical Bragg grating couplers disposed over one of the plurality of reflector portions, a chip waveguide; a magneto-optic layer encapsulated in the dielectric layer; and a metal layer forming a plurality of metal connection pads and a plurality of wire traces for electrically connecting the PIC chip to electronic components.