3D Photonic Semiconductor Packaging for Optical-Electrical Integration
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Solution Overview
Problem
Existing technologies face challenges in efficiently integrating optical and electrical components in computing systems, particularly in reducing the size and cost of high-performance computing systems while maintaining effective optical coupling and signal transmission.
Innovation Solution
A 3D package structure is developed that includes both optical and electronic devices, with a photonic routing structure for optical communication, using silicon waveguides and dielectric layers to confine light, and a method of bonding site devices to an interconnect structure for reduced thickness and improved optical coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical and electrical components are integrated in traditional package structures, then signal transmission and processing capabilities are achieved, but the size and cost of high-performance computing systems increase
Solution Approach 1:
The patent transitions from traditional 2D planar packaging to 3D vertical stacking architecture. Multiple functional layers (optical waveguides, electronic devices, interconnect structures) are stacked vertically to utilize the third dimension, thereby reducing the footprint area while maintaining integration density and signal transmission capabilities
Solution Approach 2:
The patent implements nested integration where electronic devices are positioned within or adjacent to optical waveguide structures. The interconnect structure is embedded within the stack, with through-vias penetrating through dielectric layers to connect different functional layers, creating a compact nested arrangement that reduces overall package volume
2Reliability
If traditional integration methods are used, then optical and electrical components can be combined, but manufacturing complexity and costs increase
Solution Approach 1:
The patent divides the integrated package into distinct functional layers: optical waveguide layer, electronic device layer, and interconnect layer. Each layer is manufactured and optimized independently, then assembled through controlled stacking. This segmentation simplifies the manufacturing process by allowing specialized fabrication techniques for each layer type while maintaining high optical coupling efficiency through precise alignment features
Solution Approach 2:
The patent introduces dielectric layers and interconnect structures as intermediary elements between optical waveguides and electronic devices. These intermediaries provide mechanical support, electrical isolation, and alignment registration, facilitating the integration process while maintaining optimal optical coupling without requiring direct contact between optical and electronic components
3Volume of stationary object
If device thickness is reduced for compactness, then package size decreases, but optical coupling effectiveness may be compromised
Solution Approach 1:
The patent employs thin dielectric films and layered structures that maintain optical transparency while providing mechanical support and alignment. The thin-film architecture enables compact thickness while preserving optical coupling effectiveness through controlled refractive index profiles and precise layer thickness optimization that maintains evanescent field interaction between waveguides and electronic devices
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables reduced size and processing costs of high-speed computing systems with enhanced optical coupling and flexibility in design, allowing for efficient signal transmission between optical fibers and electronic components.
Implementation Method 1
silicon waveguides and dielectric layers to confine light
Implementation Method 2
a grating coupler, wherein the silicon waveguide is optically coupled to the photonic devices and to the grating coupler
Data Source
AI summary
A device includes a photonic routing structure including a silicon waveguide, photonic devices, and a grating coupler, wherein the silicon waveguide is optically coupled to the photonic devices and to the grating coupler; an interconnect structure on the photonic routing structure, wherein the grating coupler is configured to optically couple to an external optical fiber disposed over the interconnect structure; and computing sites on the interconnect structure, wherein each computing site includes an electronic die bonded to the interconnect structure, wherein each electronic die of the computing sites is electrically connected to a corresponding photonic device of the photonic devices.