Low-Temperature Photonic Transmission Structure for 3D PIC Stacking

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Solution Overview

Problem

Conventional deposition processes for forming optical structures in photonic integrated circuits (PICs) at high temperatures can damage existing layers, preventing the creation of robust, three-dimensional structures.

Innovation Solution

Utilizing a sputtering process with low operating temperatures to form photonic transmission structures, including non-alkali oxide solutions with niobium cations, which maintain refractive indices similar to silicon nitride while reducing optical loss and ensuring structural integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional deposition processes are used to form optical structures at high temperatures, then the refractive index and optical properties can be controlled, but existing layers are damaged and structural integrity deteriorates

Engineering Contradiction:
Improverefractive index controlVSAvoidstructural integrity
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent changes the temperature parameter from conventional high-temperature deposition to low-temperature sputtering processes (below 200°C), enabling formation of optical structures without damaging existing layers while maintaining control over refractive index through material composition adjustment

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs composite material structures including non-alkali oxide solutions with niobium cations, tantalum pentoxide, and silicon dioxide layers with specific refractive indices, allowing optimization of both optical properties and structural integrity through material selection rather than relying solely on high-temperature processing

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If high-temperature deposition is used to form photonic structures, then optical properties can be achieved, but three-dimensional vertically stacked structures cannot be formed due to layer damage

Engineering Contradiction:
Improveoptical propertiesVSAvoidthree-dimensional structure capability
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent transitions from planar two-dimensional structures to three-dimensional vertically stacked photonic transmission structures by implementing multiple alternating layers of high-refractive-index and low-refractive-index materials, enabling vertical light confinement and complex optical functionality through dimensional expansion

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent uses low-temperature sputtering deposition to enable formation of multiple vertically stacked layers without interlayer damage, allowing three-dimensional structuring while maintaining optical properties through controlled deposition parameters and material selection

Inventive Principle:
Principle #35Parameter changes

3Ease of manufacture

If conventional deposition processes are used, then processing can be performed, but optical loss increases and performance deteriorates

Engineering Contradiction:
Improveprocessing capabilityVSAvoidoptical loss
Core Design Contradiction:
Ease of manufactureVSLoss of energy

Solution Approach 1:

The patent changes the deposition temperature parameter to low-temperature sputtering (below 200°C) and adjusts material composition parameters (niobium cation concentration, oxide ratios) to minimize optical loss while maintaining ease of manufacture through standard semiconductor processing equipment

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses composite material systems including non-alkali oxide solutions with specific cations (niobium, tantalum) combined with silicon dioxide and nitrogen-containing dielectric materials to achieve low optical loss through material composition optimization rather than relying on high-temperature processing

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the formation of reliable, three-dimensional PICs with vertically stacked structures, minimizing damage to existing layers and improving performance and reliability.

Implementation Method 1

the first active structure is formed using a first sputtering process, the second active structure is formed using a second sputtering process

Methodology Applied
Scientific EffectSputtering: Sputtering

Data Source

PatentUS12474524B2Photonic transmission structure
Publication Date: 2025.11.18 VIAVI SOLUTIONS INC(US)
  • US12474524B2 patent drawing
  • US12474524B2 patent drawing
  • US12474524B2 patent drawing

AI summary

In some implementations, a photonic transmission structure includes a first cladding structure; a first active structure disposed over the first cladding structure; and a second cladding structure disposed over the first active structure. The first active structure includes a non-alkali, oxide solution that includes a cation that is niobium.