Photonic Substrate Intermediate Layer for Thermal Management
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Solution Overview
Problem
Current optical devices face heat management issues due to electrical power dissipation, leading to potential catastrophic failure, as existing heat absorption solutions increase device size and are inefficient in transferring heat from the source of generation.
Innovation Solution
Incorporating a high thermal conductivity intermediate layer with a lower refractive index, such as CVD Diamond, directly between the bulk and device layers to efficiently transfer heat away from the heat generation region without adding size, thereby eliminating the need for external heat sinking materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat absorption material is bonded to an already formed optical device, then heat dissipation is improved, but device size increases significantly
Solution Approach 1:
The patent incorporates the heat absorption layer during the substrate formation process before the optical device is fully formed. This preliminary action allows the heat dissipation structure to be integrated into the device architecture from the beginning, eliminating the need for additional external heat sinking materials and reducing overall device size while maintaining effective heat dissipation.
Solution Approach 2:
The patent merges the heat absorption function with the substrate structure by forming an intermediate layer between the bulk substrate and the optical device layer. This combining of structural and thermal management functions eliminates separate heat sinking components, thereby improving heat dissipation without increasing device volume.
2Temperature
If heat absorption material is bonded to an already formed optical device, then heat dissipation is improved, but the material is situated far away from the heat generation region
Solution Approach 1:
The heat absorption intermediate layer is formed during the substrate preparation stage, positioned between the bulk substrate and the optical device layer before the device is completed. This preliminary positioning ensures the heat absorption material is immediately adjacent to the heat generation region, maximizing thermal coupling efficiency and minimizing the distance for heat transfer.
Solution Approach 2:
The patent introduces an intermediate layer as a thermal mediator between the bulk substrate and the optical device. This intermediate layer is specifically designed with high thermal conductivity to efficiently conduct heat away from the heat generation region, serving as a direct thermal pathway that minimizes distance and improves heat dissipation effectiveness.
3Temperature
If an intermediate layer with higher thermal conductivity is used, then heat transfer efficiency is improved, but the layer must be integrated into the substrate structure
Solution Approach 1:
The intermediate layer is designed to serve multiple functions: it provides mechanical support as part of the substrate structure, acts as a thermal management layer for heat dissipation, and maintains optical compatibility with the device. This multi-functionality allows high heat transfer efficiency to be achieved without significantly increasing structural complexity, as the same layer performs multiple roles.
Solution Approach 2:
The patent employs composite material strategies by selecting materials for the intermediate layer that provide both structural integrity and high thermal conductivity. The use of composite or specially selected materials allows the intermediate layer to simultaneously fulfill mechanical and thermal management requirements, improving heat transfer efficiency while keeping the substrate structure manageable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces peak operating temperatures and prevents device failure by ensuring efficient heat transfer, maintaining device functionality without increasing the device's size or using external heat absorption materials.
Implementation Method 1
an intermediate layer disposed between the bulk layer and the device layer comprising a second material having a higher thermal conductivity
Data Source
AI summary
Embodiments of the invention describe substrates, used to form optical devices, which include high thermal conductivity intermediate layers. Said substrates comprise a bulk layer, an optical device layer comprising a first material, and an intermediate layer disposed between the bulk layer and the device layer comprising a second material having a higher thermal conductivity and a lower index of refraction than the first material.In the resulting devices, said intermediate layer functions as part of the device layer structure—i.e., provides optical or electrical power dissipation (i.e. thermal) functionality for the device formed from said substrate. Thus, optical devices do not necessarily need to utilize an add-on packaging solution for heat absorption when formed from substrate stacks according to embodiments of the invention. Moreover, in some embodiments, said intermediate layer is located at “zero-distance” from the source of the heat generation, thereby efficiently transferring heat out of that region.