Photonic Subsystem Encapsulation for Laser Beam Alignment

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Solution Overview

Problem

Current photonic subsystem integration methods, such as hermetic sealing, are complex, costly, and time-consuming due to the need for additional silicon wafer processing steps and separate laser diode integration, which complicates the packaging process.

Innovation Solution

A photonic subsystem with a laser source and optical components mounted on a substrate, encapsulated in a material with a higher refractive index than the encapsulant, such as silicone, to provide reliable and efficient optical focusing and directing into a photonic platform, using micro-lenses and micro-prisms with specific refractive indices and curvatures for optimal beam alignment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If hermetic sealing process is used to seal the photonic subsystem, then reliability is improved, but device complexity and manufacturing cost increase significantly

Engineering Contradiction:

ImprovereliabilityVSAvoidcomplexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the laser source and optical components from the silicon photonic device and integrates them into a separate photonic subsystem packaged in a different material (e.g., ceramic or metal). This separation allows each subsystem to be optimized independently, reducing the complexity of hermetic sealing while maintaining reliability through material-appropriate packaging solutions.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent segments the photonic system into distinct subsystems: a silicon photonic device and a separately packaged photonic subsystem containing the laser source. This segmentation enables independent optimization of each subsystem's packaging approach, avoiding the need for complex hermetic sealing of the entire integrated system while maintaining reliability through targeted protection of sensitive components.

Inventive Principle:

Principle #1Segmentation

2Reliability

If hermetic sealing process is used to seal the photonic subsystem, then reliability is improved, but manufacturing time and cost increase

Engineering Contradiction:

ImprovereliabilityVSAvoidmanufacturing efficiency

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent performs preliminary packaging of the laser source and optical components in a photonic subsystem before final integration with the silicon photonic device. This preliminary action allows the subsystem to be pre-tested and pre-packaged using simpler, faster methods, reducing the time and complexity of the final hermetic sealing process while maintaining reliability.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent employs a photonic subsystem package that may not require the same level of permanent hermetic sealing as traditional approaches. By using materials and sealing methods that are faster to apply and remove if needed, the manufacturing process becomes more efficient while still providing adequate protection for reliable operation.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Adaptability or versatility

If separate laser diode is integrated into the photonic device, then optical source function is provided, but packaging process complexity increases

Engineering Contradiction:

Improveoptical source functionVSAvoidpackaging complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent merges the laser source, optical components, and mounting structure into a single integrated photonic subsystem. This merging reduces packaging complexity by treating the entire assembly as one unit with a single packaging approach, rather than separately packaging and integrating multiple components into the silicon photonic device.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The photonic subsystem is designed as a universal module that can be integrated with different silicon photonic devices. The subsystem provides multiple functions (laser generation, optical focusing, beam directing) in a single package, reducing the overall packaging complexity while maintaining the required optical source functionality and adaptability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach simplifies the integration process, reduces packaging costs, and maintains high optical performance and reliability, enabling efficient coupling of the laser beam to the photonic platform with improved temperature stability and suitability for large-volume manufacturing.

Implementation Method 1

at least one optical component is fabricated from a material having a refractive index value that is higher than the refractive index value of the encapsulant

Methodology Applied

Scientific EffectRefraction: Refraction

Data Source

PatentUS11460680B2Photonic subsystem

Publication Date: 2022.10.04 UNIV COLLEGE CORK NAT UNIV OF IRELAND CORK

AI summary

At least one embodiment of the invention provides a photonic subsystem for integrating onto a photonic platform. The subsystem comprises a laser source and a plurality of optical components for focusing and directing a laser beam emitted from the laser source into a photonic platform. The laser source and plurality of optical components are mounted to a substrate and encapsulated.