Photonic Integrated Circuit Through-Hole Transmission Wire
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Solution Overview
Problem
Semiconductor integrated circuits face limitations in increasing signal transfer speed due to electric resistance, which hinders the efficiency of electric communication, and optical communication offers higher speed but requires innovative integration solutions.
Innovation Solution
A photonic integrated circuit design featuring a substrate with through holes and transmission wires that combine optical and electrical transmission structures, along with optical-to-electrical converters, to enable simultaneous and efficient transmission of optical and electrical signals, enhancing integration and communication speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If electric communication is used in semiconductor integrated circuits, then electrical signals can be transmitted through interconnections, but electric resistance limits the signal transfer speed
Solution Approach 1:
The patent combines optical and electrical transmission structures within a single transmission wire that passes through through-holes in the substrate. The transmission wire includes both an optical transmission structure (optical waveguide) and an electrical transmission structure (metal conductor), allowing simultaneous optical and electrical signal transmission through the same physical pathway, thereby resolving the contradiction between speed and resistance limitations
Solution Approach 2:
The transmission wire is designed to perform multiple functions: it serves as both an optical signal transmission path and an electrical signal transmission path. The through-holes in the substrate are utilized to accommodate both optical waveguides and metal conductors, making the same structural element serve dual purposes and eliminating the need for separate transmission paths
2Speed
If optical communication is adopted to improve communication speed, then signal transmission speed increases, but integration with electrical transmission requires innovative solutions
Solution Approach 1:
The patent merges optical and electrical transmission functionalities into a unified transmission wire structure. The transmission wire comprises an optical waveguide portion and a metal conductor portion that are integrated within the same through-hole pathway in the substrate, simplifying the overall integration by using a common structural framework for both signal types
Solution Approach 2:
The transmission wire is segmented into distinct functional portions: an optical transmission structure portion for optical signal transmission and an electrical transmission structure portion for electrical signal transmission. These segments are arranged within the same through-hole, allowing independent optimization of each transmission mode while maintaining compact integration
3Productivity
If separate through-holes are used for optical and electrical transmission, then signal transmission is possible, but the number of through-holes increases substrate complexity
Solution Approach 1:
The through-holes in the substrate are designed as multi-functional pathways that accommodate both optical waveguides and metal conductors. Each through-hole serves as a universal transmission channel that can carry both optical and electrical signals, eliminating the need for separate dedicated through-holes for each signal type and reducing overall substrate complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the integration and communication speed of photonic integrated circuits by allowing simultaneous optical and electrical signal transmission, reducing electric resistance, and increasing the reliability of optical signal transmission.
Implementation Method 1
an optical-to-electrical converter connected to the optical transmission structure of the transmission wire on the first surface
Data Source
AI summary
A photonic integrated circuit is provided. The photonic integrated circuit includes a substrate having a through hole interconnecting a first surface and a second surface; a transmission wire passing through the through hole and including an optical transmission structure and an electrical transmission structure; and an optical-to-electrical converter connected to the optical transmission structure of the transmission wire on the first surface.