Photonic Wafer Package Layout for Long-Range Memory Bandwidth
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Solution Overview
Problem
Conventional computing systems face limitations in scaling memory capacity and bandwidth due to parasitic impedance in conductive traces, which restricts the distance between memory chips and processors, thereby limiting memory bandwidth and capacity.
Innovation Solution
The development of photonic substrates with lithographically patterned photonic modules and power delivery substrates, such as bridge dies and interposers, that convey electric power from a substrate carrier to photonic modules and electronic dies, enabling uniform power distribution across large photonic substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional conductive traces are used to connect memory chips and processors, then electrical power and signals can be transmitted, but parasitic impedance increases with distance, limiting the maximum separation distance between components
Solution Approach 1:
The patent replaces conventional electrical conductive traces with photonic waveguides for signal transmission between processors and memory chips. This substitution eliminates the parasitic impedance issue inherent in electrical conductors, as photonic systems do not suffer from the same resistive losses. The waveguides enable optical signal transmission over longer distances without the quadratic impedance increase that plagues electrical interconnects.
Solution Approach 2:
The invention changes the transmission medium from electrical conductors to optical waveguides, fundamentally altering the physical parameters of signal transmission. By using photonic instead of electronic interconnects, the system achieves lower loss characteristics and enables greater separation distances between components while maintaining signal integrity.
2Quantity of substance
If photonic substrates with large area are used to increase memory capacity, then more memory chips can be integrated, but uniform power distribution becomes difficult due to distance from power delivery substrates
Solution Approach 1:
The patent introduces power delivery substrates positioned adjacent to the photonic substrate that serve as intermediaries for power distribution. These substrates deliver power directly to the periphery of the photonic substrate, eliminating the need for power to travel through long distances from a central source. This intermediary power delivery mechanism enables uniform power distribution across large-area photonic substrates supporting high memory capacity.
3Quantity of substance
If memory chips are placed far from processors to increase capacity, then more memory can be integrated, but bandwidth decreases due to parasitic impedance in conductive traces
Solution Approach 1:
The patent replaces electrical conductive traces with photonic waveguides for data transmission between processors and memory chips. This substitution resolves the fundamental conflict between distance and bandwidth, as photonic interconnects maintain high transmission quality over longer distances without the parasitic impedance losses that degrade electrical signals. The waveguide-based optical interconnects enable high-bandwidth communication across large-area photonic substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach overcomes the limitations of parasitic impedance in conductive traces, allowing for scalable memory capacity and bandwidth, and enables uniform power distribution, reducing temperature variations and maintaining optical network functionality.
Implementation Method 1
photonic modules embedded in the photonic substrate... optically coupled to one another
Implementation Method 2
power delivery substrate configured to convey electric power from the substrate carrier to the first electronic die... bridge die comprises conductive traces configured to support propagation of the electric power
Implementation Method 3
lid covering the photonic substrate, wherein the lid is in thermal contact with the first electronic die
Data Source
AI summary
Described herein are photonic communication platforms and related packages. In one example, a photonic package includes a substrate carrier having a recess formed through the top surface of the substrate carrier. The substrate carrier may be made of a ceramic laminate. A photonic substrate including a plurality of photonic modules is disposed in the recess. The photonic modules may be patterned using a common photomask, and as a result, may share a same layer pattern. A plurality of electronic dies may be positioned on top of respective photonic modules. The photonic modules enable communication among the dies in the optical domain. Power delivery substrates may be used to convey electric power from the substrate carrier to the electronic dies and to the photonic substrate. Power delivery substrates may be implemented, for example, using bridge dies or interposers (e.g., silicon or organic interposers).