Photonic Waveguide Isolation in Encapsulated IC Packages

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Solution Overview

Problem

Existing integrated circuit (IC) encapsulation methods require additional packaging steps for added functions, increasing cost and limiting functionality, and struggle with signal radiation due to increasing frequencies and short wavelengths, which can cause signal lines to act as antennas, leading to energy loss.

Innovation Solution

Incorporating a photonic bandgap structure within the encapsulation material using additive manufacturing to create a photonic waveguide that provides galvanic signal path isolation, allowing signals to be transferred between systems with different ground references or voltage levels, reducing radiation loss and enabling efficient signal propagation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If additional packaging steps are added to provide extra functions in IC encapsulation, then functionality is improved, but manufacturing complexity and cost increase

Engineering Contradiction:

ImprovefunctionalityVSAvoidpackaging steps

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The encapsulation material is designed to perform multiple functions simultaneously: it provides mechanical protection, electrical insulation, and photonic waveguiding for signal transmission. By integrating the photonic waveguide structure directly into the encapsulation material, the patent eliminates the need for separate packaging steps for signal isolation, achieving multi-functionality in a single component

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent combines the encapsulation function with the photonic waveguide function into a single integrated structure. The photonic waveguide is formed within the encapsulation material itself, merging two previously separate functions (protection and signal isolation) into one unified component, thereby reducing manufacturing steps

Inventive Principle:

Principle #5Merging (Combining)

2Speed

If signal lines are used at increasing frequencies, then data transmission speed is improved, but signal radiation loss increases as signal lines act as antennas

Engineering Contradiction:

Improvedata transmission speedVSAvoidsignal radiation loss

Core Design Contradiction:

SpeedVSLoss of energy

Solution Approach 1:

The photonic waveguide acts as an intermediary structure that guides electromagnetic signals between IC components without allowing them to radiate into the surrounding encapsulation material. The waveguide confines the electromagnetic fields within its structure, preventing the signal lines from acting as antennas and reducing radiation loss while maintaining high-frequency signal transmission

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If photonic bandgap structure is integrated into encapsulation material, then galvanic signal path isolation is achieved, but manufacturing process complexity increases

Engineering Contradiction:

Improvegalvanic signal path isolationVSAvoidmanufacturing process

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The photonic bandgap structure is designed and integrated into the encapsulation material during the initial encapsulation process rather than being added as a separate subsequent step. This preliminary integration approach achieves galvanic signal path isolation while minimizing manufacturing process complexity by combining steps

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The photonic bandgap structure effectively isolates galvanic signals, preventing radiation loss and enabling reliable signal transfer between systems, while also providing voltage protection and reducing the need for additional packaging steps, thus enhancing the functionality and efficiency of IC encapsulation.

Implementation Method 1

a first portion of the encapsulation material may include a photonic bandgap structure that provides a photonic waveguide

Methodology Applied

Scientific EffectPhotonic bandgap: Photonic Crystal

Data Source

PatentUS10444432B2Galvanic signal path isolation in an encapsulated package using a photonic structure

Publication Date: 2019.10.15 TEXAS INSTRUMENTS INC

AI summary

An encapsulated package is provided that includes a pair integrated circuit (IC) die. A radio frequency (RF) circuit on one of the IC die is operable to transmit an RF signal having a selected frequency. An RF circuit on the other IC die is operable to receive the RF signal Encapsulation material encapsulates the IC die. A photonic waveguide couples between the RF transmitter and RF receiver to form galvanic path isolation between the two IC die. The photonic waveguide is formed by a photonic structure within the encapsulation material.