Photonics Die Singulation with Etched Optical-Quality Edges
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for singulating photonics dies in LIDAR systems either produce non-optical quality edges or are costly due to individual polishing of each die.
Innovation Solution
A method involving a combination of etching a trench on the front side of the wafer and performing a mechanical cut from the backside, ensuring the cut overlaps with the trench to separate the dies while maintaining optical quality edges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional mechanical cutting is used to separate photonics dies, then productivity is improved, but manufacturing precision deteriorates due to non-optical quality edges
Solution Approach 1:
The patent divides the singulation process into two separate operations: (1) etching a trench through the die to create an optical quality edge, and (2) performing a mechanical cut through the wafer to separate the dies. This segmentation allows each process to optimize for its specific function - etching for precision and cutting for productivity.
Solution Approach 2:
The patent performs the etching operation before the mechanical cutting operation. By pre-etching the trench through the die, the optical quality edge is created in advance, and the subsequent mechanical cut can proceed without compromising this precision feature.
2Manufacturing precision
If individual polishing is performed on each die to achieve optical quality edges, then manufacturing precision is improved, but productivity deteriorates due to costly and time-consuming processes
Solution Approach 1:
The patent extracts the optical quality edge creation step from the individual die processing sequence and performs it collectively on the entire wafer through batch etching. This eliminates the need for individual polishing operations on each die.
Solution Approach 2:
The patent replaces the mechanical polishing process with a chemical etching process for creating optical quality edges. The etching process can be performed in batch on the entire wafer, significantly improving productivity compared to individual mechanical polishing of each die.
3Manufacturing precision
If only etching is used to create optical quality edges, then manufacturing precision is improved, but productivity deteriorates due to incomplete die separation
Solution Approach 1:
The patent merges two previously separate processes - etching and mechanical cutting - into a combined singulation process. The etching creates the optical quality edge while the subsequent mechanical cut completes the die separation, achieving both precision and productivity goals simultaneously.
4Productivity
If a single cutting process is used to separate dies, then productivity is improved, but manufacturing precision deteriorates due to inability to achieve optical quality edges
Solution Approach 1:
The patent segments the singulation process into distinct etching and cutting operations, each optimized for its specific purpose. The etching process targets optical quality edge creation while the cutting process targets efficient die separation, resolving the contradiction between precision and productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the production of photonics dies with optical quality edges at a lower cost by utilizing a combination of etching and mechanical cutting techniques.
Implementation Method 1
an etching component to etch a trench on a first surface of the wafer
Implementation Method 2
a cutting component to perform a cut on a second surface of the wafer
Data Source
AI summary
A method of singulating a die of a wafer includes etching a trench on a first surface of a wafer comprising a die and performing a cut on a second surface of the wafer, wherein the cut overlaps with the trench on the first surface of the wafer to separate the die from the wafer.