Photonics Edge Coupler Continuous Crackstop

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Solution Overview

Problem

Photonics chips face vulnerability to crack propagation and moisture ingress due to discontinuities in crackstops required for accommodating edge couplers, which can lead to catastrophic failure.

Innovation Solution

A structure with a dielectric layer, a waveguide core, and a crackstop where a communication passageway extends laterally beneath the crackstop, allowing for a continuous crackstop that reduces vulnerability while enabling effective optical signal transmission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the crackstop includes a discontinuity to accommodate the edge coupler, then the edge coupler can be integrated into the photonics chip, but the vulnerability to crack propagation and moisture ingress increases

Engineering Contradiction:
Improveintegration of edge couplerVSAvoidvulnerability to crack propagation
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The waveguide core is positioned in a vertical dimension beneath the crackstop discontinuity, allowing optical signals to pass through the horizontal gap without interfering with the crackstop's protective function. This dimensional separation enables both the edge coupler integration and crack propagation resistance to coexist.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If the crackstop includes a discontinuity to allow passage of the waveguide core, then optical coupling is enabled, but light attenuation due to back-end-of-line metallization increases

Engineering Contradiction:
Improveoptical signal transmissionVSAvoidlight attenuation
Core Design Contradiction:
Adaptability or versatilityVSLoss of energy

Solution Approach 1:

The waveguide core operates in a vertical layer beneath the metallization plane, allowing optical signals to travel horizontally through the discontinuity region without intersecting with metal traces that would cause attenuation. This layered dimensional arrangement separates optical and electrical pathways.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The discontinuity in the crackstop acts as an intermediary structure that provides an optical pathway through the metallization layer without requiring direct physical contact between the waveguide core and metal traces, thereby minimizing electromagnetic interference and light absorption.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If a continuous crackstop is implemented, then protection against crack propagation and moisture ingress is improved, but accommodation of the edge coupler becomes difficult

Engineering Contradiction:
Improveprotection against crack propagationVSAvoidaccommodation of edge coupler
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The edge coupler structure is positioned in a lower vertical layer while the crackstop resides in an upper layer, allowing the crackstop to maintain continuity without physically blocking the edge coupler's optical pathway. The discontinuity is created only in the upper crackstop layer where it does not interfere with optical signals.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The crackstop structure is segmented into multiple layers, with the discontinuity confined to specific upper layers while lower layers remain continuous, allowing selective accommodation of the edge coupler while maintaining overall protective functionality.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS11543606B2Photonics chips with an edge coupler and a continuous crackstop
Publication Date: 2023.01.03 GLOBALFOUNDRIES US INC
  • US11543606B2 patent drawing
  • US11543606B2 patent drawing
  • US11543606B2 patent drawing

AI summary

Structures including an edge coupler and a crackstop, as well as methods of forming a structure including an edge coupler and a crackstop. A waveguide core and a crackstop are located over a top surface of a dielectric layer. A communication passageway is either optically coupled or electrically coupled to the waveguide core. The communication passageway, which may include an electric conductor or a buried waveguide core, extends laterally beneath the crackstop.