Semiconductor Photonics Modulator Heater Layout for Heating Efficiency

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Solution Overview

Problem

The inefficiency of modulator heater structures in semiconductor photonics devices due to heat loss in dielectric layers, leading to increased power consumption and reduced operational efficiency.

Innovation Solution

A horizontal arrangement of optical modulator and modulator heater structures, where the heater sections are positioned laterally adjacent to the modulator, minimizing heat loss through dielectric layers and improving heating efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If modulator heater structures are used to stabilize resonant wavelengths, then operational stability is improved, but heat loss in dielectric layers increases power consumption

Engineering Contradiction:
Improveresonant wavelength stabilityVSAvoidpower consumption
Core Design Contradiction:
Stability of the object's compositionVSUse of energy by moving object

Solution Approach 1:

The patent repositions the heater structure from a vertical arrangement (above the modulator) to a lateral arrangement (adjacent to the modulator in the same dielectric layer). This dimensional change eliminates heat loss through vertical dielectric layers while maintaining thermal coupling for resonant wavelength stabilization.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The invention extracts the heater structure from the vertical stack and places it laterally adjacent to the modulator. This separation removes the problematic dielectric layers between the heater and modulator, eliminating the source of heat loss while preserving the heating function.

Inventive Principle:
Principle #2Taking out (Extraction)

2Ease of manufacture

If traditional vertical heater structures are used, then ease of manufacture is improved, but heating efficiency deteriorates due to heat loss

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidheat loss
Core Design Contradiction:
Ease of manufactureVSLoss of energy

Solution Approach 1:

The heater is repositioned from a vertical arrangement to a lateral arrangement within the same dielectric layer, changing the spatial dimension of thermal coupling. This maintains manufacturing simplicity while eliminating heat loss through intermediate dielectric layers.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The heater structure is positioned locally adjacent to the modulator region, providing targeted heating only where needed. This localized approach improves heating efficiency by concentrating thermal energy at the modulator while minimizing heat loss to surrounding dielectric layers.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Reduces power consumption and enhances operational efficiency by stabilizing resonant wavelengths, thereby improving the performance of semiconductor photonics devices.

Implementation Method 1

a modulator heater structure may be located near the optical modulator structure to provide heat to the optical modulator structure

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS20250314917A1Semiconductor photonics devices and methods of formation
Publication Date: 2025.10.09 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20250314917A1 patent drawing
  • US20250314917A1 patent drawing
  • US20250314917A1 patent drawing

AI summary

A semiconductor photonics device includes an optical modulator structure and a modulator heater structure. The position of the modulator heater structure, the shape of the modulator heater structure, and/or the material(s) of the modulator heater structure are selected to increase the heating efficiency of the modulator heater structure.