Semiconductor Photonics Mirror Structure for Top-Surface Fiber Coupling

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing semiconductor devices face challenges in efficiently transmitting modulated optical signals due to optical loss and limited propagation distances, particularly when coupling output optical fibers to side surfaces rather than top surfaces.

Innovation Solution

The semiconductor photonics device incorporates a mirror structure supported by a semiconductor support structure, positioned at an angle relative to the semiconductor substrate, to redirect modulated optical signals from a waveguide to an output optical fiber coupled to the top surface, enabling wafer-level testing and reducing propagation distances.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If output optical fiber is coupled to side surface of semiconductor device, then device structure is simpler, but optical loss increases and propagation distance is limited

Engineering Contradiction:
Improvedevice structureVSAvoidoptical loss
Core Design Contradiction:
Device complexityVSLoss of energy

Solution Approach 1:

The patent transitions from side-surface coupling to top-surface coupling by introducing a mirror structure that redirects the optical path. The mirror redirects the optical signal from propagating in a first direction to a second direction, enabling top-surface coupling and reducing optical loss while maintaining manufacturing feasibility

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If output optical fiber is coupled to side surface of semiconductor device, then manufacturing process is easier, but propagation distance is limited

Engineering Contradiction:
Improvemanufacturing processVSAvoidpropagation distance
Core Design Contradiction:
Ease of manufactureVSLength of stationary object

Solution Approach 1:

The mirror structure enables top-surface coupling by redirecting the optical path in a different spatial dimension, which reduces the propagation distance required for optical signal transmission while maintaining ease of manufacture through standard semiconductor fabrication processes

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Loss of energy

If mirror structure is introduced to redirect optical signal to top surface, then optical loss is reduced and propagation efficiency increases, but device complexity increases

Engineering Contradiction:
Improveoptical lossVSAvoiddevice structure
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The mirror structure acts as an intermediary element that redirects the optical signal from the waveguide to the top surface coupling point. This intermediary component reduces optical loss and enables top-surface coupling while being integrated into the existing device architecture

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The mirror introduces a spatial redirection in a different dimension, allowing the optical signal to reach the top surface coupling point with reduced propagation distance and optical loss, while the overall device footprint remains compact

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces optical loss and increases operating efficiency by minimizing propagation distances and allowing for enhanced inspection and verification during wafer-level testing.

Implementation Method 1

the mirror structure is configured to receive a modulated optical signal from the one or more waveguides, where the mirror structure is configured to redirect the modulated optical signal from a first direction, that is approximately parallel with a top surface of the semiconductor substrate, to a second direction that is approximately perpendicular to the first direction

Methodology Applied
Scientific EffectReflection: Reflection

Data Source

PatentUS20250180833A1Semiconductor photonics device and methods of formation
Publication Date: 2025.06.05 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20250180833A1 patent drawing
  • US20250180833A1 patent drawing
  • US20250180833A1 patent drawing

AI summary

A semiconductor photonics device may include a photonic integrated circuit and may be coupled with an output optical fiber at a top surface of the semiconductor photonics device. To facilitate coupling of modulated optical signals to the output optical fiber at the top surface of the semiconductor photonics device, the semiconductor photonics device may include a mirror structure that is supported by a semiconductor support structure included in the semiconductor photonics device. The mirror structure may be positioned at an angle relative to a surface of a semiconductor substrate of the semiconductor photonics device, which enables the mirror structure to transfer a modulated optical signal propagating in a first direction to a second direction toward the output optical fiber.