Photonics Chip Optical Interfaces With Adjacent Edge Couplers
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Solution Overview
Problem
Space on a photonics chip for optical input/output channels is limited, restricting the available space for external communication paths.
Innovation Solution
A structure comprising multiple photonics chips with adjacent optical couplers at their edges, utilizing tapered sections as optical couplers to enable high-density chip-to-chip communication without physical connections, facilitated by index-matching fluids and metamaterial structures for efficient light transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If optical input/output channels are added to photonics chips for external communication, then communication capacity is improved, but chip space is consumed
Solution Approach 1:
The patent merges multiple photonics chips into a multi-chip module where optical input/output channels are shared across all chips. Instead of dedicating separate optical channels to each chip, the system combines the optical interfaces at the module level, allowing multiple chips to communicate externally through a smaller number of shared optical channels. This merging approach maintains high communication capacity while significantly reducing the total optical interface space required on individual chips.
Solution Approach 2:
The optical input/output channels are designed to serve multiple functions and multiple chips simultaneously. The same optical interface structure is used universally across all chips in the module, allowing a single optical channel to facilitate communication for multiple chips. This universal design reduces redundancy and optimizes the use of chip space for optical interfaces.
2Area of moving object
If multiple photonics chips are integrated in close proximity, then space efficiency is improved, but optical coupling between chips becomes more difficult
Solution Approach 1:
The patent introduces optical coupling structures that act as intermediaries between adjacent photonics chips. These coupling structures are integrated into the module packaging and provide a standardized interface that simplifies the optical coupling process. Rather than requiring direct precision alignment between chip optical interfaces, the intermediary coupling structures facilitate light transfer between chips, making the manufacturing and assembly process more tolerant and easier to execute.
3Productivity
If optical couplers are placed at chip edges for external communication, then communication efficiency is improved, but chip area available for photonic circuit is reduced
Solution Approach 1:
By merging optical interfaces at the module level rather than providing dedicated optical couplers on each chip, the patent reduces the total area consumed by optical couplers on individual chips. Multiple chips share common optical interface structures located at the module boundary, which maintains communication efficiency while freeing up chip area for photonic circuit implementation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates high-bandwidth, low-loss chip-to-chip communication through a high-density array of optical couplers, enhancing the capacity for optical input/output channels without the need for photonic wire bonding.
Implementation Method 1
facilitated by index-matching fluids for efficient light transfer
Data Source
AI summary
Structures including multiple photonics chips and methods of fabricating a structure including multiple photonics chips. The structure comprises a first chip including a first edge and a first plurality of optical couplers disposed at the first edge, and a second chip including a second edge adjacent to the first edge of the first chip and a second plurality of optical couplers. The second plurality of optical couplers are disposed at the second edge adjacent to the first plurality of optical couplers.