Integrated photonics package and method of forming same
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing photonics packaging technologies lack protection against moisture, are not suitable for surface-mounted assembly, require active alignment for light coupling, and lack efficient heat dissipation and fiber pigtailing capabilities.
Innovation Solution
An integrated photonics package encapsulated in a plastic layer, comprising an electrical signal module, silicon photonics processing unit, light-emitting unit, micro-optical coupler, and heat sink structure, allowing for passive assembly, in-package optical interconnection, and efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If chip-on-substrate packaging is used, then the packaging structure is simple, but it lacks protection against moisture
Solution Approach 1:
The patent employs a composite packaging structure combining a ceramic sub-mount for mechanical support and heat dissipation, a plastic encapsulation layer for moisture protection, and a metal heat sink for thermal management. This multi-material approach resolves the contradiction by integrating the protective functions of different materials while maintaining structural simplicity.
2Reliability
If gold box packaging is used, then moisture protection is provided, but it is not suitable for surface mounted assembly
Solution Approach 1:
The patent segments the packaging into distinct functional layers: a ceramic sub-mount for mounting, a plastic encapsulation layer for protection, and exposed solder pads for surface-mounted assembly. This segmentation allows the package to achieve both moisture protection and SMT compatibility by separating protective functions from assembly interface functions.
3Temperature
If off-chip light source packaging is used, then heat dissipation is improved, but active alignment is required for light coupling
Solution Approach 1:
The patent incorporates a pre-designed optical coupling structure with integrated alignment features during the packaging fabrication process. The ceramic sub-mount includes predefined mounting positions and the plastic encapsulation is molded to include optical pathways, eliminating the need for post-assembly active alignment while maintaining effective light coupling and heat dissipation.
4Ease of operation
If fiber pigmtailing is performed from the side, then optical connection is achieved, but 6 degree-of-freedom active alignment is required
Solution Approach 1:
The patent introduces a ceramic sub-mount as an intermediary component that provides a stable mechanical platform with integrated optical alignment features. This intermediary structure establishes fixed geometric relationships between the light source, optical pathways, and fiber coupling points, enabling passive alignment and eliminating complex 6-degree-of-freedom adjustment mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a moisture-protected, surface-mounted photonics package with passive alignment and efficient heat dissipation, enabling high-speed data transmission and fiber pigtailing.
Implementation Method 1
An integrated photonics package encapsulated in a plastic encapsulation layer
Implementation Method 2
a heat sink structure... capable of in-package heat dissipation from an embedded light source (laser diode)
Implementation Method 3
The micro-optical coupler may include a plurality of waveguides, each having an input end and an output end perpendicular to and in optical communication with the input end
Implementation Method 4
a reflector is provided at an intersection of the first and second sections so as to form an acute angle of 45° with each of the first and second sections
Data Source
AI summary
An integrated photonics package and a method of forming it are disclosed. The integrated photonics package includes, encapsulated in a plastic encapsulation layer, an electrical signal module, a silicon photonics processing unit, a light-emitting unit, a heat sink structure and a micro-optical coupler. The electrical signal module is electrically connected and configured to both the silicon photonics processing unit and the light-emitting unit. The silicon photonics processing unit, the light-emitting unit and the micro-optical coupler are spaced apart, and the silicon photonics processing unit is located between the light-emitting unit and the micro-optical coupler. The light-emitting unit is configured to provide horizontal light, which is then processed by the silicon photonics processing unit and guided by the micro-optical coupler to vertically exit the integrated photonics package, thereby achieving in-package optical interconnection.