Silicon Photonics Package Layout for Modulator Thermal Stress
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Solution Overview
Problem
Silicon photonics devices face challenges in managing heat due to the presence of optical components like wavelength modulators, which can undermine performance and structural integrity.
Innovation Solution
A thermal management approach is implemented through a packaging design that includes a photonic integrated circuit (PIC) die with a heating element thermally coupled to the modulator, using dielectric layers, electrical connectors, and underfill material to maintain structural stability and performance during high temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If wavelength modulators are integrated into silicon photonics devices, then optical signal processing capability is improved, but thermal stress and structural integrity deteriorate
Solution Approach 1:
The device is divided into functionally independent regions: a first region containing the wavelength modulator and a second region containing the bonding structure. This segmentation allows the modulator region to operate at elevated temperatures for optimal optical performance while the bonding structure region maintains structural integrity, resolving the contradiction between optical capability and structural reliability.
2Temperature
If heating elements are added for thermal management, then temperature control capability is improved, but device complexity increases
Solution Approach 1:
The bonding structure serves multiple functions: it provides mechanical bonding between layers, acts as a thermal management pathway, and enables temperature control of the wavelength modulator. By making the bonding structure multi-functional, heating elements are not needed as separate components, thus improving temperature control capability without significantly increasing device complexity.
3Adaptability or versatility
If high temperature operation is enabled for modulators, then optical performance is improved, but material stability deteriorates
Solution Approach 1:
Different regions of the device are designed with different thermal characteristics. The first region (modulator region) is designed to withstand and operate at elevated temperatures for optimal optical performance, while the second region (bonding structure region) maintains material stability. This local differentiation of thermal properties allows high temperature operation to improve optical performance without compromising overall material stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively manages thermal stress without compromising the structural integrity or performance of the device, ensuring reliable operation of wavelength modulators and other silicon photonics components.
Implementation Method 1
a photonic integrated circuit (PIC) die with a heating element thermally coupled to the modulator
Implementation Method 2
using dielectric layers, electrical connectors, and underfill material to maintain structural stability and performance during high temperatures
Data Source
AI summary
In an embodiment, a method includes: forming an integrated circuit die, forming the integrated circuit die comprising: forming an interconnect structure over a front side of a substrate, the interconnect structure comprising a photonic component and a heater, the substrate comprising a first dielectric layer over a semiconductor substrate; removing the semiconductor substrate to expose a back side of the first dielectric layer; forming a second dielectric layer over the back side of the first dielectric layer; forming a redistribution structure over the second dielectric layer, the redistribution structure extending through the first dielectric layer and the second dielectric layer to be electrically connected to the interconnect structure; and forming an electrical connector over the redistribution structure; attaching a package substrate to the electrical connector; and attaching an electronic die over the interconnect structure and over the front side of the package substrate.