Photonics Die V-Groove Barriers for Passive Lens Alignment

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Solution Overview

Problem

Current photonics die assemblies require active alignment of lens arrays, which is time-consuming and not compatible with high-volume manufacturing, and lack passive alignment features to simplify the assembly process.

Innovation Solution

Incorporation of passive alignment features such as v-grooves and barrier structures to align lens arrays with photonics dies, allowing for early optical testing and reducing the need for active alignment equipment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If active alignment processes are used to align lens arrays with photonics dies, then alignment precision is improved, but manufacturing time and process complexity increase

Engineering Contradiction:
Improvealignment precisionVSAvoidmanufacturing speed
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

V-grooves are pre-formed on the photonics die surface before lens array assembly. These grooves serve as predetermined alignment features that guide the lens arrays into correct positions, eliminating the need for time-consuming active alignment processes during final assembly while maintaining precise alignment.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The v-grooves act as intermediary alignment features between the photonics die and the lens arrays. By providing physical guidance structures, the grooves mediate the alignment process, allowing passive alignment without requiring complex active alignment equipment or procedures.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If pigtail fiber connectors are used for optical connections, then connection reliability is improved, but device complexity and assembly time increase

Engineering Contradiction:
Improveconnection reliabilityVSAvoidassembly complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent removes the pigtail fiber connector component from the optical connection system. By using direct coupling between the photonics die and lens arrays via v-groove alignment, the intermediate connector is eliminated, simplifying the overall device structure while maintaining optical connection reliability.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The alignment function and connection function are merged into a single integrated structure. The v-grooves provide both mechanical alignment and optical coupling pathways, combining what were previously separate functions (alignment mechanisms and optical connectors) into one unified approach.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If barrier structures are added to protect v-grooves, then groove protection is improved, but manufacturing process complexity increases

Engineering Contradiction:
Improvegroove protectionVSAvoidprocess simplicity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

Barrier structures are incorporated into the manufacturing process at an early stage, before the v-grooves are fully exposed or used. By pre-forming or pre-positioning the barriers during die fabrication or packaging, the protection is built-in without requiring additional complex assembly steps later in the manufacturing process.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS12388051B2Barriers for grooves in photonics dies
Publication Date: 2025.08.12 INTEL CORP
  • US12388051B2 patent drawing
  • US12388051B2 patent drawing
  • US12388051B2 patent drawing

AI summary

Embodiments disclosed herein include photonics packages. In an embodiment, a photonics package includes a photonics die and a plurality of v-grooves on the photonics die. A barrier structure proximate the plurality of v-grooves.