Photoreactive Bonding Agent for Plated Substrate Adhesion
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Solution Overview
Problem
Existing methods for forming plating on glass or silicon substrates often require surface irregularities to enhance adhesion, which can lead to signal transmission loss and heat generation issues, especially when forming fine conductor patterns.
Innovation Solution
A production method involving a photoreactive bonding agent applied to the substrate surface, followed by light irradiation, washing, catalyst binding, and electroless plating, allowing for strong adhesion without surface irregularities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an etching process is performed to form fine irregularities on the substrate surface to improve interfacial adhesion, then the adhesion between substrate and plating is improved, but signal transmission loss and heat generation occur due to surface irregularities
Solution Approach 1:
The patent introduces a photoreactive bonding agent as an intermediary layer between the substrate and plating. This bonding agent forms a self-assembled monolayer that provides strong interfacial adhesion through chemical bonding without requiring surface irregularities. The smooth intermediate layer eliminates signal transmission loss and heat generation while maintaining sufficient peel strength.
Solution Approach 2:
The patent changes the chemical parameters of the substrate surface by applying a photoreactive bonding agent that undergoes photochemical reaction upon light irradiation. This transforms the surface properties to enable strong adhesion through chemical bonding rather than mechanical interlocking, allowing smooth surface topology to be maintained.
2Strength
If an etching process is performed to form fine irregularities on the substrate surface, then interfacial adhesion is improved, but fine pattern formation of conductor wiring is hindered
Solution Approach 1:
The photoreactive bonding agent serves as a mediator that enables strong adhesion without surface irregularities, providing a smooth platform for precise fine pattern formation of conductor wiring while maintaining sufficient interfacial adhesion strength.
3Ease of manufacture
If conventional electroless plating is performed directly on the substrate surface, then the process is simple, but insufficient interfacial adhesion and peel strength are achieved
Solution Approach 1:
The patent performs preliminary action by applying and curing the photoreactive bonding agent on the substrate surface before electroless plating. This preliminary step creates a chemically active surface that strongly binds to both the substrate and subsequent plating layer, ensuring sufficient interfacial adhesion and peel strength.
Solution Approach 2:
The photoreactive bonding agent acts as an intermediary layer that facilitates strong bonding between the substrate and plating, resolving the adhesion problem while maintaining process simplicity through the addition of only one extra step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves high interfacial adhesion and sufficient peel strength for plating on smooth glass or silicon substrates, preventing signal loss and heat generation, and enabling precise formation of fine conductor patterns.
Implementation Method 1
an irradiation step for irradiating the surface of the substrate, on which the photoreactive bonding agent is provided, with light to allow the surface of the substrate and the photoreactive bonding agent to be bonded to each other
Implementation Method 2
a catalyst provision step for, after the first washing step, providing a catalyst that binds to the photoreactive bonding agent
Implementation Method 3
a plating step for disposing a conductive substance on the photoreactive bonding agent by an electroless plating process after the second washing step, the catalyst binding to the photoreactive bonding agent
Data Source
AI summary
Provided is a production method for a plated substrate, comprising: providing a photoreactive bonding agent on a surface of a substrate made of glass or silicon; irradiating the surface of the substrate, on which the photoreactive bonding agent is provided, with light to allow the surface of the substrate and the photoreactive bonding agent to be bonded to each other; after the irradiation, removing by washing the photoreactive bonding agent that is not bonded to the surface of the substrate; after the first washing, providing a catalyst that binds to the photoreactive bonding agent; after the catalyst provision, removing by washing the catalyst that does not bind to the photoreactive bonding agent; and disposing a conductive substance on the photoreactive bonding agent by an electroless plating process after the second washing, the catalyst binding to the photoreactive bonding agent.