Photoreactive Plasma Adjustment for Local Uniformity Control
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Solution Overview
Problem
Plasma processing apparatuses face challenges in controlling plasma asymmetry, which affects the uniformity and efficiency of etching and deposition processes, particularly in local areas within the plasma chamber.
Innovation Solution
Incorporation of a plasma adjustment assembly with a photoreactive material layer and light sources that change capacitance in specific regions between electrodes and a focus ring, allowing for independent control of light irradiation to improve plasma uniformity and control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If radiation symmetrical control method or RF characteristics control of matcher is used, then plasma asymmetry is controlled, but local plasma characteristics cannot be controlled
Solution Approach 1:
The patent divides the plasma control system into multiple independent regions by placing separate photoreactive material layers at different positions (between upper electrode-lower electrode and between focus ring-lower electrode), each可控 by independent light sources. This segmentation enables localized plasma characteristic adjustment without affecting the entire chamber, resolving the contradiction between overall plasma control and local plasma uniformity.
Solution Approach 2:
The patent applies local quality by using photoreactive material layers that can be selectively irradiated by light sources to change capacitance in specific local regions. This allows different parts of the plasma chamber to have different plasma characteristics tailored to local processing requirements, achieving both overall plasma control and local plasma uniformity simultaneously.
2Manufacturing precision
If photoreactive material layer with light sources is added, then local plasma control is enabled, but device complexity increases
Solution Approach 1:
The patent introduces photoreactive material layers as intermediary components between the electromagnetic fields and the plasma. These layers act as mediators that convert light energy into capacitance changes, which in turn control plasma characteristics. This intermediary approach enables sophisticated local plasma control while maintaining a relatively simple overall device structure, as the photoreactive layers can be integrated into existing chamber components.
3Manufacturing precision
If multiple light sources are used for local control, then plasma uniformity is improved, but energy consumption increases
Solution Approach 1:
The patent employs partial action by using multiple light sources that can be independently controlled and activated only when and where needed. Rather than continuously operating all light sources, the system selectively activates specific light sources corresponding to regions requiring plasma adjustment, thereby achieving plasma uniformity while minimizing overall energy consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances plasma uniformity and process yield by enabling local plasma control, thereby improving the consistency and effectiveness of plasma processing operations.
Implementation Method 1
a photoreactive material layer between the upper electrode and the substrate stage or between the focus ring and the substrate stage and including a material whose capacitance is changeable according to an irradiated light
Data Source
AI summary
A plasma processing apparatus includes a chamber providing a space for processing a substrate, a substrate stage configured to support the substrate within the chamber and including a lower electrode, an upper electrode facing the lower electrode, a focus ring in or on an upper peripheral region of the substrate stage to surround the substrate, and a plasma adjustment assembly in at least one of a first position between the upper electrode and the lower electrode and a second position between the focus ring and the lower electrode, the plasma adjustment assembly including a photoreactive material layer and a plurality of light sources configured to irradiate light onto a local region of the photoreactive material layer. A capacitance of the local region is changed as the light is irradiated to the local region.