Electrophotographic Photoreceptor Press-Fit Alignment
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Solution Overview
Problem
The existing electrophotographic photoreceptors suffer from total runout issues due to fitting imperfections between the electroconductive substrate and the support member, leading to uneven image density and quality, particularly in high-volume printing applications.
Innovation Solution
An electrophotographic photoreceptor design featuring a cylindrical electroconductive substrate with a thickness of 2 mm or more and socket joint portions at both ends, combined with a support member flange having a fitting portion with an outer diameter larger than the opening by 0.01 mm to 0.1 mm, which is press-fit to minimize runout and ensure proper alignment and contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional fitting method is used between the electroconductive substrate and support member, then assembly is simple, but total runout occurs causing uneven image density
Solution Approach 1:
The patent applies local quality by creating a socket joint portion with enhanced thickness specifically at the end portions of the electroconductive substrate where fitting occurs, while maintaining normal thickness at the center. This localized reinforcement provides the necessary precision and runout suppression at the critical fitting locations without adding complexity throughout the entire component.
Solution Approach 2:
The patent implements preliminary action by pre-forming the socket joint portion with increased thickness during substrate manufacturing, and pre-configuring the support member with a corresponding fitting portion with controlled outer diameter. This preliminary preparation ensures precise fit and minimal runout before the photoreceptor is installed in the imaging device.
2Strength
If the substrate thickness is increased to prevent deformation, then structural strength improves, but manufacturing complexity increases
Solution Approach 1:
The patent applies local quality by creating a socket joint portion with enhanced thickness specifically at the end portions of the electroconductive substrate where fitting occurs, while maintaining normal thickness at the center. This localized reinforcement provides the necessary precision and runout suppression at the critical fitting locations without adding complexity throughout the entire component.
Solution Approach 2:
The patent implements parameter changes by varying the thickness parameter of the electroconductive substrate along its axial direction. The socket joint portion has a greater thickness than the center portion, creating an optimized thickness distribution that provides strength where needed while minimizing overall material usage and manufacturing complexity.
3Manufacturing precision
If the fitting portion outer diameter is made larger to ensure proper contact, then alignment improves, but friction and scraping increase
Solution Approach 1:
The patent implements parameter changes by precisely controlling the outer diameter of the fitting portion to be within a specific range (0.01 mm to 0.1 mm larger than the opening diameter). This optimized parameter range ensures adequate contact for alignment while minimizing excessive friction and scraping that would occur with a larger interference fit.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses total runout, maintaining high image quality and reducing unevenness in image density both initially and over time, even under prolonged use, by preventing deformation and scraping of the substrate and flange.
Implementation Method 1
a support member fit into the openings of the electroconductive substrate, having an fitting portion which has an outer diameter that is larger than a diameter of the opening by a range of from approximately 0.01 mm to approximately 0.1 mm, the fitting portion being press-fit into the opening
Data Source
AI summary
An electrophotographic photoreceptor includes: an electrophotographic photoreceptor body containing a cylindrical electroconductive substrate having openings at both ends in an axial direction, the cylindrical electroconductive substrate having a thickness of approximately 2 mm or more at a center portion in an axial direction and having a socket joint portion on each of inner surfaces of both end portions in an axial direction; and a photosensitive layer provided on an outer surface of the electroconductive substrate; and a support member fit in the openings of the electroconductive substrate, having an fitting portion which has an outer diameter that is larger than a diameter of the opening by a range of from approximately 0.01 mm to approximately 0.1 mm, the fitting portion being press-fit into the opening.