Photoirradiation Release Coating for Thick Semiconductor Lamination
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Solution Overview
Problem
Existing release agent compositions struggle to form a thick release agent layer on semiconductor substrates with irregularities while maintaining good appearance, releasability, and cleanability, which is crucial for three-dimensional semiconductor integration.
Innovation Solution
A release agent composition comprising Novolac resin, (meth)acrylic acid ester-based polymer, and solvent, with specific structural units and ratios, forming a thick release agent layer of 0.5 μm to 10 μm, enabling easy separation of semiconductor substrates using photoirradiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a thin release agent layer of approximately 200 nm is formed, then the appearance and cleanability are good, but it is difficult to cover the irregularities of the semiconductor substrate
Solution Approach 1:
The patent changes the chemical composition parameters of the release agent by incorporating specific polymers with controlled molecular weights and compositions. This allows the release agent to achieve both adequate thickness for coverage and maintained performance characteristics, resolving the contradiction between thickness and quality.
Solution Approach 2:
The patent uses a composite release agent system comprising multiple polymer components with different properties. This composite structure enables the release agent layer to achieve both sufficient thickness for covering substrate irregularities and the necessary mechanical properties for good appearance and cleanability.
2Manufacturing precision
If the release agent layer thickness is increased to cover irregularities, then coverage is improved, but appearance and cleanability deteriorate
Solution Approach 1:
The patent optimizes the molecular weight distribution and chemical composition of the polymer components to enable the release agent to form a thick yet high-quality layer. Specific parameter ranges for polymer composition allow simultaneous achievement of adequate thickness and maintained appearance/cleanability properties.
3Manufacturing precision
If a thick release agent layer is formed, then coverage of irregularities is improved, but releasability may be compromised
Solution Approach 1:
The patent carefully controls the chemical composition and molecular weight parameters of the polymer components to ensure that even at increased thickness, the release agent maintains its releasability. The specific polymer selection and ratio optimization enable thick layers to still release easily after polishing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition allows for a thick release agent layer with good appearance, releasability, and cleanability, facilitating the separation of semiconductor substrates without damage during polishing, supporting three-dimensional integration.
Implementation Method 1
the release layer includes a Novolac resin that absorbs light having a wavelength of 190 nm to 600 nm emitted through the support and undergoes a change in properties
Data Source
AI summary
There is provided a release agent composition for photoirradiation release, containing: a Novolac resin, a (meth)acrylic acid ester-based polymer, and a solvent.