Photoresist Developer Composition for Fine-Feature Pattern Resolution

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Solution Overview

Problem

As semiconductor devices shrink in size, the process windows for photolithographic processing have become tighter, necessitating advances to maintain the ability to scale down components and meet design criteria.

Innovation Solution

A photoresist developer composition and method that utilizes a negative photoresist with cross-linking properties, enhanced by specific polymer resins, photoactive compounds, and solvents, to create chemical differences in exposed and unexposed regions, enabling precise pattern transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional photolithographic processing is used, then existing manufacturing capabilities are maintained, but the ability to scale down to smaller feature sizes is lost

Engineering Contradiction:
Improvefeature sizeVSAvoidprocess window
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent modifies the chemical composition parameters of the photoresist system by introducing specific cross-linking agents and polymer resins with controlled molecular weights and functionalities. These parameter changes enable the photoresist to maintain structural integrity at smaller feature sizes while preserving adequate process windows through optimized chemical reactions during exposure and development

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention creates a composite photoresist system combining multiple polymer resins with different glass transition temperatures, cross-linking agents, and photoactive compounds. This composite formulation allows simultaneous optimization of resolution for small features and process stability, as each component contributes specific properties that collectively resolve the contradiction between feature size reduction and process window maintenance

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If photoresist composition is simplified, then manufacturing ease is improved, but pattern precision and resolution are reduced

Engineering Contradiction:
Improvepattern resolutionVSAvoidphotoresist composition
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies local quality by incorporating specific functional components at optimized concentrations within the photoresist composition. Different polymer resins, cross-linking agents, and photoactive compounds are strategically formulated to provide localized chemical functions that enhance pattern resolution without requiring complex overall composition, allowing precise control over exposure and development characteristics

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances the ability to form precise patterns in smaller semiconductor features, improving resolution and reducing defects, thus supporting the miniaturization of semiconductor devices.

Implementation Method 1

The photoresist layer is selectively exposed to actinic radiation thereby crosslinking the photoresist layer in a region of the photoresist layer exposed to the actinic radiation

Methodology Applied
Scientific EffectPhotopolymerisation: Photopolymerisation

Implementation Method 2

The region of the photoresist exposed to actinic radiation is removed by developing the photoresist layer by applying a liquid developer to the photoresist layer

Methodology Applied
Scientific EffectSolvation: Solvation

Data Source

PatentUS12487527B2Photoresist developer and method of developing photoresist
Publication Date: 2025.12.02 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US12487527B2 patent drawing
  • US12487527B2 patent drawing
  • US12487527B2 patent drawing

AI summary

A photoresist developer includes a solvent having Hansen solubility parameters of 15<δd<25, 10<δp<25, and 6<δp<30; an acid having an acid dissociation constant, pKa, of −15<pKa<4, or a base having a pKa of 40>pKa>9.5; and a chelate.