Photoresist Line Pattern Layout to Prevent Collapse and Overlap
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Solution Overview
Problem
Photoresist structures in semiconductor manufacturing can collapse or overlap due to excessive length, affecting reliability and yield.
Innovation Solution
Incorporation of dummy photoresist structures with specific geometric arrangements, such as fences, intersections, and zigzag configurations, to balance distribution and prevent overlap.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photoresist structures are made longer to achieve desired pattern dimensions, then manufacturing precision is improved, but reliability deteriorates due to collapse and overlap
Solution Approach 1:
The patent divides long photoresist structures into multiple shorter segments by introducing dummy photoresist structures between them. This segmentation prevents the collapse and overlap issues that occur in continuous long structures while maintaining the required overall pattern dimensions. The dummy structures act as intermediate support elements that break up the continuous long structure into manageable segments.
Solution Approach 2:
Dummy photoresist structures serve as intermediary elements positioned between adjacent photoresist structures. These intermediaries provide mechanical support and spacing that prevents direct contact and potential overlap between the main photoresist structures, thereby maintaining reliability while allowing the necessary pattern dimensions to be achieved.
2Area of stationary object
If photoresist structures are made longer to meet design requirements, then area coverage is improved, but structural stability deteriorates leading to collapse
Solution Approach 1:
By segmenting long photoresist structures with dummy structures, the patent maintains large area coverage through extended pattern layouts while preventing structural collapse. The segmentation creates multiple shorter stable units that collectively cover the required area without suffering from the instability of continuous long structures.
Solution Approach 2:
Dummy photoresist structures are preliminarily positioned between adjacent photoresist structures before the final patterning process. This preliminary arrangement establishes structural support and spacing that prevents collapse during subsequent manufacturing steps, ensuring stability is built into the structure before critical operations occur.
3Productivity
If photoresist structures are placed closer together to increase density, then productivity is improved, but reliability deteriorates due to overlap risks
Solution Approach 1:
Dummy photoresist structures function as intermediary spacers that enable higher density placement of functional photoresist structures. By positioning dummy structures between adjacent structures, the patent allows closer spacing of productive elements while maintaining reliable separation, thereby increasing manufacturing throughput without sacrificing pattern integrity.
Solution Approach 2:
The segmentation of photoresist structures with dummy intermediaries enables increased density by creating distinct separated units that can be placed closer together. The dummy structures ensure that even at higher densities, the functional structures remain separated and non-overlapping, allowing productivity improvements while maintaining reliability.
Data Source
AI summary
The present disclosure provides a semiconductor structure and a method of manufacturing a semiconductor structure. The semiconductor structure includes a first set of photoresist structures, a second photoresist structure, and a third photoresist structure. The first set of photoresist structures is disposed along a first orientation. The second photoresist structure is disposed non-parallel to the first orientation. The third photoresist structure is disposed non-parallel to the first orientation. The second photoresist structure and the third photoresist structure contact at least one of the first set of photoresist structures.


